K4F8E3S4HD-GFCL

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K4F8E3S4HD-GFCL

8Gbit x32 LPDDR4 FBGA-200 Memory (ICs) RoHS

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  • Mfr. Parte #K4F8E3S4HD-GFCL
  • Paquete
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  • En stock4995

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Especificaciones

Packaging FBGA-200
Interface LPDDR4
Memory Format x32
Memory Size 8Gbit
Operating temperature -40℃~+95℃
Voltage - Supply 1.8V;1.1V

Descripción general

Description

The term "K4F8E3S4HD-GFCL" does not correspond to any widely recognized concept, product, or terminology that I am aware of, as of my last update in October 2023. It appears to be a sequence of characters that could potentially represent a model number, a code, or an internal reference within a specific context, such as a proprietary system, a project, or a fictional work. If it pertains to a specific product or concept, more context would be required to provide an accurate introduction. If it is related to a recent development or niche area not covered in my training data, I recommend checking current sources or the context in which you encountered it for more detailed information.

Features

The K4F8E3S4HD-GFCL is a model number that typically represents a type of electronic component, often found in devices like smartphones, tablets, or other gadgets. While specific details can vary by manufacturer, the features generally associated with such components include:
1. Memory Type: Often a form of DRAM (Dynamic Random-Access Memory) or NAND flash memory, providing storage and data management capabilities.
2. Capacity: The alphanumeric code often signifies memory capacity, which could range from a few gigabytes to terabytes, depending on the application.
3. Speed: Indicates data transfer rates and efficiency, essential for tasks requiring high-speed access and processing.
4. Power Efficiency: These components are designed to consume less power, extending battery life in portable devices.
5. Form Factor: Compact and integrated design suitable for space-constrained environments, facilitating slim and lightweight device construction.
6. Durability: Built to withstand various environmental conditions, contributing to device longevity.
To get accurate and specific details, refer to the manufacturer's datasheet or product documentation for the K4F8E3S4HD-GFCL.

Package

The package type for K4F8E3S4HD-GFCL is a BGA (Ball Grid Array). This packaging method involves mounting the microchip with solder balls on its underside, allowing for efficient connectivity and space-saving on a circuit board.

Pinout

The K4F8E3S4HD-GFCL is a mobile DRAM memory chip manufactured by Samsung. This particular chip is part of their LPDDR4X series, designed for high-performance and energy-efficient memory applications in mobile devices.
The K4F8E3S4HD-GFCL has a 178-ball FBGA (Fine-Pitch Ball Grid Array) package. The primary function of this chip is to provide volatile storage for mobile devices, enabling quick read and write access necessary for smooth operation of applications and operating systems. It offers advantages like reduced power consumption and improved data rates, which are critical for extending battery life while maintaining high-speed performance in modern mobile devices.
Due to its LPDDR4X classification, this memory chip supports lower operating voltages (down to 0.6V for I/O) compared to standard LPDDR4 chips, further enhancing power efficiency. This makes it suitable for smartphones, tablets, and other portable devices requiring fast and efficient memory solutions.

Manufacturer

The K4F8E3S4HD-GFCL is a product manufactured by Samsung. Samsung is a South Korean multinational conglomerate known for its diverse range of businesses, but it is primarily recognized as a global leader in technology and electronics. The company is involved in the production of various electronic components, including semiconductors, memory chips, and consumer electronics such as smartphones, tablets, televisions, and home appliances. Samsung's semiconductor division, specifically, is one of the largest in the world, making it a key player in the global supply chain for electronic components.

Application

The K4F8E3S4HD-GFCL is not a widely recognized model number or product identifier as of my last update. It might refer to a specific component, device, or technology not covered in general databases. Typically, model numbers similar to this could belong to electronics, sensors, or specialized industrial components. If it's a part of a specific system, its application areas would depend on that system's use, such as telecommunications, computing, manufacturing, or automotive industries. For precise applications, consulting the manufacturer's documentation or product datasheet would be necessary.

Equivalent

To determine equivalent products for the K4F8E3S4HD-GFCL chip, you would need to identify its key specifications, such as memory type, capacity, speed, and package type. Typically, products from manufacturers like Samsung, Micron, SK Hynix, and Kingston might offer comparable chips. Without specific details from the datasheet or product description, it's best to consult a distributor or use a component comparison tool for precise equivalents.

Envío

Métodos de envíoNosotros

ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.


Referencia de tarifas de envío (DHL/FedEx):

DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.

FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.

Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.

Pagos

Payment Methods

El plazo de pago es 100% prepagado.

Actualmente, solo aceptamos los siguientes métodos de pago:

1. de PayPal

2. Tarjeta de crédito/débito

3. Transferencia bancaria