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IS46TR16640B-15GBLA2
IC DRAM 1GBIT PARALLEL 96TWBGA
- Fabricante
- Mfr. Parte #IS46TR16640B-15GBLA2
- Paquete BGA-96
- Hoja de datos
- En stock5342
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Especificaciones
| Package | Tray |
| ProductStatus | Obsolete |
| MemoryType | Volatile |
| MemoryFormat | DRAM |
| Technology | SDRAM - DDR3 |
| MemorySize | 1Gb (64M x 16) |
| MemoryInterface | Parallel |
| ClockFrequency | 667 MHz |
| WriteCycleTime-WordPage | 15ns |
| AccessTime | 20 ns |
| Voltage-Supply | 1.425V ~ 1.575V |
| OperatingTemperature | -40°C ~ 105°C (TC) |
| MountingType | Surface Mount |
| Package/Case | 96-TFBGA |
Descripción general
Description
This specific model is optimized for low latency and power consumption, making it ideal for applications in mobile devices, consumer electronics, and other portable devices where energy efficiency is crucial. The chip is built using advanced semiconductor technology, ensuring reliability and performance.
The "BLA2" designation typically references specific packaging and thermal characteristics, while the "15" refers to the speed grade, indicating the maximum clock frequency of the device. Overall, the IS46TR16640B-15GBLA2 is a versatile memory solution supporting modern computing needs.
Features
1. Architecture: It utilizes a 4-bit wide data input/output with a 16-bit wide organization.
2. Speed: Operates at a clock frequency of up to 150 MHz (15 ns cycle time).
3. Voltage: Typically operates at 3.3V, ensuring compatibility with modern systems.
4. Burst Mode: Supports burst read and write operations for improved performance in applications requiring high data throughput.
5. Refresh: Incorporates an automatic refresh feature, supporting both normal and self-refresh modes, ensuring data integrity.
6. Package: Offered in a compact 54-ball FBGA (Fine Ball Grid Array) package for space-efficient designs.
This SDRAM is suitable for various applications, including consumer electronics, telecommunications, and embedded systems, where reliable performance and efficiency are essential.
Package
Pinout
The primary functions of the pins include:
- Address Inputs (A0-A18): Used to select memory locations.
- Data Inputs/Outputs (DQ0-DQ3): Four data lines for reading from and writing to the memory.
- Control Signals: Includes Chip Enable (CE), Output Enable (OE), and Write Enable (WE), which control the operations of the memory.
- Ground (VSS) and Power Supply (VDD): Provide the necessary power and ground reference for the chip.
- Byte Control (LB, UB): Selects data bus width for lower or upper byte operations.
This configuration allows for efficient data storage and retrieval in various applications, including computing and telecommunications.
Manufacturer
Application
Equivalent
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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