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IS41LV16100D-50TLI
IC DRAM 16MBIT PAR 50TSOP II
- Fabricante
- Mfr. Parte #IS41LV16100D-50TLI
- Paquete 50-TSOP
- Hoja de datos IS41LV16100D-50TLI DataSheet
- En stock2924
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Especificaciones
| Package | Tray |
| ProductStatus | Active |
| MemoryType | Volatile |
| MemoryFormat | DRAM |
| Technology | DRAM - EDO |
| MemorySize | 16Mb (1M x 16) |
| MemoryInterface | Parallel |
| AccessTime | 25 ns |
| Voltage-Supply | 3V ~ 3.6V |
| OperatingTemperature | -40°C ~ 85°C (TA) |
| MountingType | Surface Mount |
| Package/Case | 50-TSOP (0.400, 10.16mm Width), 44 Leads |
Descripción general
Description
This SRAM features a wide operating voltage range, typically between 2.7V and 3.6V, making it compatible with modern low-voltage designs. It offers asynchronous read and write capabilities, enabling quick data manipulation, which is ideal for cache memory and high-speed data buffering.
The chip is provided in a compact TLI (Thin Leadless) package, enhancing its integration into space-constrained applications. Its low standby current further contributes to energy efficiency, making it an excellent choice for battery-operated devices. Overall, the IS41LV16100D-50TLI combines speed, efficiency, and compact design, making it a reliable solution for various memory-intensive applications.
Features
1. Access Time: Offers a maximum access time of 50 ns, ensuring fast data retrieval.
2. Low Power Consumption: Designed for low-power applications, it features reduced standby and active power consumption.
3. CMOS Technology: Utilizes advanced CMOS technology for enhanced performance and efficiency.
4. Interface: Compatible with standard DRAM interfaces, facilitating easy integration into various systems.
5. Organization: The chip is organized as 2M x 8 bits, making it suitable for applications requiring 8-bit data paths.
6. Refresh Capability: Employs a ballistically refreshed architecture, allowing for data integrity over time.
7. Package: Available in a compact TFBGA (Thin Fine Pitch Ball Grid Array) package for space-constrained designs.
This DRAM is ideal for use in consumer electronics, telecommunications, and portable devices requiring efficient memory solutions.
Package
Pinout
### Pin Functions:
- Address Pins (A0 - A20): Used to select the memory location.
- Data Pins (D0 - D7): Bidirectional data lines for input/output operations.
- Control Pins:
- WE (Write Enable): Activates the write operation.
- OE (Output Enable): Activates the output on the data lines.
- CE (Chip Enable): Activates the chip for read/write operations.
- Vcc: Power supply pin.
- GND: Ground reference pin.
This device operates at a 3.0V to 3.6V power supply and has a typical access time of 50 ns. It is designed for applications requiring high-speed data access in a compact package.
Manufacturer
Application
Equivalent
1. MT48LC16M16A2B (Micron)
2. K4S281632E (Samsung)
3. AS4C16M16D3L (Alliance Memory)
Always verify specifications like voltage, speed, and package type for compatibility in your specific application.
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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