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IS21TF32G-JCLI
IC FLASH 32GBIT 3.3V 153FBGA
- Fabricante
- Mfr. Parte #IS21TF32G-JCLI
- Paquete FBGA-153
- Hoja de datos
- En stock5206
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Especificaciones
| Package | Tray |
| ProductStatus | Active |
| MemoryType | Non-Volatile |
| MemoryFormat | FLASH |
| Technology | FLASH - NAND (TLC) |
| MemorySize | 256Gb (32G x 8) |
| MemoryInterface | MMC |
| ClockFrequency | 200 MHz |
| Voltage-Supply | 2.7V ~ 3.6V |
| OperatingTemperature | -40°C ~ 85°C (TA) |
| MountingType | Surface Mount |
| Package/Case | 153-VFBGA |
Descripción general
Description
How to get a concise intro:
- Identify the manufacturer (the “IS” prefix often points to a specific memory family) and obtain the datasheet.
- Verify key specs: memory type (NAND/NOR), capacity (32 Gbit), interface (SPI, ONFI/Toggle, etc.), supply voltage, operating temp, and package.
- Note features: ECC, wear leveling (for NAND), read/write speeds, and any special timing or boot requirements.
- Typical applications: embedded storage, firmware/boot memory, automotive/industrial data storage.
If you share the manufacturer or a link to the datasheet, I’ll provide a precise, compact summary.
Features
- Type: Serial NAND flash (32 Gbit)
- Interface: SPI/Quad SPI (QPI) with page/block access
- Supply voltage: 3.3V (often 2.7–3.6V range; some variants 1.8V)
- Read/Write: Sequential read up to ~150–200 MB/s; page program and block erase times specified
- Memory organization: pages (e.g., 2KB/4KB), blocks (e.g., 64KB/128KB)
- Endurance/Retention: P/E cycles in the 100k–300k range; data retention several years
- Features: On-die ECC, bad block management, wear leveling, partial-page programming
- Security: Read/write protection, hardware crypto/security options
- Temperature: Operation typically −40 to 85°C (extended range variants possible)
- Package: Common small-outline/8-pin or similar packages
For precise features, please share the manufacturer or datasheet link.
Package
Pinout
Manufacturer
- Company type: A fabless semiconductor company that designs and markets memory ICs (DRAM, SRAM) and analog/mixed-signal ICs; fabrication is outsourced to third-party foundries.
Application
- Embedded systems and IoT
- Automotive electronics (infotainment, ADAS)
- Data storage devices (SSDs, flash memory)
- Consumer electronics (cameras, set-top boxes, gaming consoles)
- Networking and telecom equipment
- Industrial and edge computing/automation applications
Equivalent
- Type (SRAM, PSRAM, NOR/NAND Flash)
- Capacity/density (e.g., 32Gbit)
- Interface (SPI, I2C, parallel)
- Package and voltage
- Temperature range
With these, I can provide cross-references (ISSI or drop-in parts from Winbond, Macronix, Cypress, etc.).
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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