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IPB200N25N3G
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- Mfr. Parte #IPB200N25N3G
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Especificaciones
| Manufacturer | Infineon Technologies |
| Package | TO-263-3 |
| Operating Temperature | -55℃~+175℃ |
| RDS(on) | 20mΩ@10V,64A |
| Drain to Source Voltage | 250V |
| Pd - Power Dissipation | 300W |
| Current - Continuous Drain(Id) | 64A |
| Reverse Transfer Capacitance (Crss@Vds) | 395pF |
| Input Capacitance(Ciss@Vds) | 7.1nF |
| Gate Threshold Voltage (Vgs(th)@Id) | 4V |
| Gate Charge(Qg) | 64nC@10V |
| Number | 1 N-channel |
Descripción general
Description
Key features of the IPB200N25N3G include its low on-resistance (Rds(on)), which minimizes power loss and enhances efficiency, particularly in high-frequency operations. The device also offers a fast switching speed, making it ideal for applications where rapid response is required.
Additionally, its rugged construction allows it to withstand high temperatures and conditions typically found in industrial settings. The package type is typically TO-220, which facilitates easy thermal management and mounting. Overall, the IPB200N25N3G is a reliable choice for engineers seeking efficient and robust MOSFET solutions in their designs.
Features
1. Voltage Rating: It has a maximum drain-source voltage (V_DS) of 250V, making it suitable for high-voltage applications.
2. Current Handling: It can handle a continuous drain current (I_D) of up to 200A at a case temperature of 25°C, allowing for robust performance in demanding environments.
3. On-Resistance: The device boasts a low on-resistance (R_DS(on)) of around 0.025 ohms, which minimizes power loss and improves thermal efficiency.
4. Fast Switching: It features rapid switching capabilities, ideal for applications like power supplies, converters, and motor drivers.
5. Thermal Performance: Designed for efficient heat dissipation with a high maximum junction temperature (T_J), enhancing reliability.
6. Package Type: Available in a TO-247 package, facilitating easy mounting and thermal management.
Overall, the IPB200N25N3G is well-suited for applications requiring high power efficiency and performance in power electronics.
Package
Pinout
1. Gate (G) - Controls the switching of the MOSFET.
2. Drain (D) - The terminal through which current flows out of the device.
3. Source (S) - The terminal through which current flows into the device.
4. Substrate (B) - Often internally connected to the source; used for thermal management and to prevent parasitic effects.
This MOSFET is designed for high-efficiency power applications, featuring low on-resistance (RDS(on)) and high breakdown voltage. It is commonly used in power management circuits, switching power supplies, and motor control applications.
Manufacturer
Application
Equivalent
Envío
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ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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