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H26M64103EMR
- Fabricante
- Mfr. Parte #H26M64103EMR
- Paquete
- Hoja de datos
- En stock28878
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Especificaciones
| Manufacturer | JLCPCB Assembly |
| Package | FBGA-153_L13.0-W11.5 |
Descripción general
Description
Key specifications may include operating voltage, access time, and refresh rates, which are important for performance and power efficiency. The chip is generally manufactured using advanced semiconductor technologies, ensuring high speed and low power consumption.
H26M64103EMR is notable for its compatibility with various memory standards, making it suitable for integration in diverse electronic systems. It is essential for developers and engineers to refer to the chip's datasheet for detailed information on pin configurations, electrical characteristics, and application guidelines.
Features
- Access Speed: Offers fast read access times, typically around 70 ns.
- Data Retention: Ensures data retention for up to 20 years, making it reliable for long-term storage.
- Erase/Program Cycles: Supports a minimum of 10,000 erase/program cycles, suitable for frequent updates.
- Interface: Utilizes a standard parallel interface for easy integration into existing systems.
- Power Efficiency: Low power consumption in active and standby modes enhances battery life in portable applications.
- Temperature Range: Designed to operate in a wide temperature range, ensuring stability in diverse environments.
The H26M64103EMR is ideal for applications such as consumer electronics, automotive systems, and industrial devices, providing a balance of performance, reliability, and efficiency.
Package
Pinout
Key pin functions include:
- D0-D7: Data input/output lines used for transferring data.
- CLE (Command Latch Enable): Used to latch command inputs.
- ALE (Address Latch Enable): Used to latch address inputs.
- WE (Write Enable): Enables write operations.
- RE (Read Enable): Enables read operations.
- CE (Chip Enable): Activates the chip for read/write operations.
- WP (Write Protect): Provides write protection when high.
- RB (Ready/Busy): Indicates the status of the device.
This chip is often used in consumer electronics, mobile devices, and other applications requiring compact and efficient non-volatile storage.
Manufacturer
Application
Equivalent
- Hynix HY57V641620
- Samsung K4S641632E
- Micron MT48LC4M16A2
- Winbond W9425G6JH
Always verify specifications and compatibility based on your specific application requirements.
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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