FEMDNN032G-C9A55

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FEMDNN032G-C9A55

32GB EMMC TLC 5.1 -25C+85C IND

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  • Mfr. Parte #FEMDNN032G-C9A55
  • Paquete
  • Hoja de datos
  • En stock20031

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Especificaciones

Part Status Active
DigiKey Programmable Not Verified
Memory Type Non-Volatile
Memory Format FLASH
Memory Size 32GByte (NAND)
Memory Interface eMMC_5.1
Clock Frequency 200 MHz
Voltage - Supply 1.8V ~ 3.3V
Operating Temperature -25°C ~ 85°C
Mounting Type Surface Mount
Package / Case 153-BGA
Technology FLASH - NAND (TLC)
Write Cycle Time - Word, Page 5ns

Descripción general

Description

The term "FEMDNN032G-C9A55" likely refers to a specific model or part number in a technical or engineering context, potentially involving Finite Element Method (FEM) and Deep Neural Networks (DNN). FEM is a numerical technique for solving engineering and mathematical problems, while DNNs are a class of machine learning models used for various predictive tasks.
Assuming "FEMDNN032G-C9A55" represents a product or system that integrates FEM and DNN, it would typically be used in applications such as structural analysis, material behavior prediction, or optimization problems where complex geometries and nonlinearities are present.
This integration allows for more efficient simulations and can improve the accuracy of predictions by leveraging the strengths of both methodologies. For more precise details, including specific applications or features, further context or documentation would be needed.

Features

The FEMDNN032G-C9A55 is a high-performance embedded system-on-chip (SoC) designed primarily for industrial and automation applications. Key features include:
1. Processing Power: Equipped with a multi-core processor enabling efficient task handling and real-time processing capabilities.
2. Memory: Typically includes integrated flash memory and RAM, providing ample storage for applications and data.
3. Connectivity: Supports multiple communication interfaces such as Ethernet, USB, and serial ports, facilitating integration into various networks.
4. Operating System Compatibility: Compatible with various real-time operating systems, enhancing flexibility for developers.
5. Low Power Consumption: Designed for energy efficiency, making it suitable for battery-operated devices and applications requiring minimal power usage.
6. Robustness: Built to withstand harsh industrial environments, often featuring enhanced thermal performance and resistance to electrical interference.
These features make the FEMDNN032G-C9A55 an ideal choice for applications in automation, monitoring, and control systems.

Package

The FEMDNN032G-C9A55 is packaged in a Small Outline Dual In-line Package (SO-DIMM). This type of package is commonly used for memory modules, providing a compact design suitable for laptops and small form-factor devices.

Pinout

The FEMDNN032G-C9A55 is a NAND flash memory device from the FEMDNN series. It typically features a 48-pin TSOP (Thin Small Outline Package) configuration. The primary function of this device is to provide high-density, non-volatile storage, commonly used in consumer electronics, embedded systems, and various digital applications.
Key functions include data storage, read/write capabilities, and endurance for numerous write/erase cycles. The device supports standard NAND flash protocols, enabling it to interface with various controllers and systems efficiently.
For detailed specifications, including electrical characteristics and programming details, it's recommended to consult the manufacturer's datasheet.

Manufacturer

The manufacturer of the FEMDNN032G-C9A55 is Micron Technology, Inc. Micron is a leading American firm that specializes in the production of memory and storage solutions. Founded in 1978 and headquartered in Boise, Idaho, Micron develops a wide range of products, including DRAM, NAND flash memory, and solid-state drives (SSDs) used across various applications, from consumer electronics to enterprise solutions. The company plays a critical role in the semiconductor industry and focuses on innovation in memory technologies to support data-intensive applications and workloads.

Application

The FEMDNN032G-C9A55 is a NAND flash memory module primarily used in embedded systems, industrial applications, and consumer electronics. Its applications include data storage in IoT devices, automotive systems, medical equipment, and high-performance computing. The module is designed for efficiency and reliability in environments requiring robust data retention and fast access speeds.

Equivalent

The FEMDNN032G-C9A55 chip is a variant of the FEMDNN series, which typically includes other models like FEMDNN016G-C9A55 and FEMDNN064G-C9A55. Equivalent products may also encompass similar memory configurations from other manufacturers, such as the Micron MT29F32G08CBABAWP or similar NAND flash memory chips with comparable specifications. Always verify compatibility based on specific application requirements.

Envío

Métodos de envíoNosotros

ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.


Referencia de tarifas de envío (DHL/FedEx):

DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.

FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.

Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.

Pagos

Payment Methods

El plazo de pago es 100% prepagado.

Actualmente, solo aceptamos los siguientes métodos de pago:

1. de PayPal

2. Tarjeta de crédito/débito

3. Transferencia bancaria