FEMDNN016G-A3A55

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FEMDNN016G-A3A55

FORESEE EMMC

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  • Mfr. Parte #FEMDNN016G-A3A55
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  • En stock4671

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Especificaciones

Part Status Obsolete
Packaging Tray

Descripción general

Description

There isn’t a widely published standard device named FEMDNN016G-A3A55. It sounds like a vendor-specific edge-AI/inference module, possibly combining a DNN accelerator (FEMDNN) with an Arm Cortex-A55 core (A55) and some on‑board memory (016G). Without a datasheet, I can only give a generic intro: it’s likely intended for embedded/edge AI inference with emphasis on low power and low latency.
What to verify in a real spec sheet:
- Compute: DNN/AI accelerator performance (TOPS) and supported networks/frameworks
- Processor: number of Cortex-A55 cores, clock speeds
- Memory: size/bandwidth, on-board DRAM
- Interfaces: PCIe/USB/SD, memory, camera sensors
- Power and temp: typical/max power, operating range
- Package/connector: form factor, pinouts, thermal requirements
If you can share the vendor name, a link to the datasheet, or image of the label, I can give a precise, concrete introduction and specs.

Features

I can’t locate an exact datasheet for FEMDNN016G-A3A55. Please share the manufacturer or a link to the datasheet. If this is a Cortex-A55 + DNN accelerator device, the typical features you’d expect are:
- CPU: ARM Cortex-A55 multicore (Armv8-A)
- AI: on-chip DNN/NN accelerator for inference
- Memory: external memory interfaces (e.g., LPDDR4/4x or DDR4)
- Storage: eMMC/NAND/SD card support
- I/O: USB 2.0/3.x, PCIe, Gigabit Ethernet, SPI/I2C/UART, CAN
- Video/Camera: MIPI CSI-2/DSI, ISP; supports up to high-definition/4K video
- Graphics: integrated GPU (e.g., Mali) on some SKUs
- Security: TrustZone, crypto accelerators, secure boot
- Power: DVFS and multiple power domains for efficiency
- Package/thermal: typically BGA or QFN with standard thermal solution
Note: these are typical features; exact specs depend on the vendor and exact SKU.

Manufacturer

I can’t identify the manufacturer from the part number FEMDNN016G-A3A55 alone. Please share a link to a datasheet, a product page, or a photo of the packaging/logo. With that, I can name the manufacturer and describe the company (e.g., whether it’s a fabless semiconductor designer, an integrated device manufacturer, or an electronics components supplier).

Application

Typical application areas:
- Edge AI inference and DNN acceleration
- Embedded vision and image/video processing
- Smart IoT gateways and devices
- Robotics and automation
- Industrial control and monitoring
- On-device speech and AI workloads

Envío

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Referencia de tarifas de envío (DHL/FedEx):

DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.

FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.

Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.

Pagos

Payment Methods

El plazo de pago es 100% prepagado.

Actualmente, solo aceptamos los siguientes métodos de pago:

1. de PayPal

2. Tarjeta de crédito/débito

3. Transferencia bancaria

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