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FDMF3180
LOW VOLTAGE SMART POWER STAGE 3
- Fabricante
- Mfr. Parte #FDMF3180
- Paquete 39-PowerVFQFN
- Hoja de datos
- En stock2077
100% original & Nuevo
24 horas listos para el envío
Garantía de 365 días
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Especificaciones
| Package | Tape & Reel (TR),Cut Tape (CT),Bulk |
| ProductStatus | Active |
| OutputConfiguration | Half Bridge (2) |
| Applications | General Purpose |
| Interface | Logic, PWM |
| LoadType | Inductive, Capacitive |
| Technology | Power MOSFET |
| Current-Output/Channel | 70A |
| OperatingTemperature | -40°C ~ 125°C (TA) |
| FaultProtection | Current Limiting, Over Temperature, UVLO |
| MountingType | Surface Mount |
| Package/Case | 39-PowerVFQFN |
Descripción general
Description
Generally, an introductory course would cover the fundamental principles and concepts of its subject, providing students with a foundational understanding necessary for more advanced study. The course might include lectures, readings, discussions, and practical exercises related to the topic.
For detailed information, such as the syllabus, objectives, and prerequisites, it would be best to consult the institution offering the course or check the course catalog or website where it is listed. This will provide specific insights into what FDMF3180 entails and what students can expect to learn.
Features
1. Integration: Combines a driver IC, synchronous MOSFETs, and a Schottky diode in a single package, reducing board space and improving reliability.
2. Efficiency: Offers high efficiency across a wide load range, thanks to its advanced MOSFET technology and optimized driver design.
3. Current Sensing: Includes accurate current sensing for enhanced system performance and reliability.
4. Protection Features: Provides built-in protections such as over-current, over-temperature, and under-voltage protection to enhance system safety.
5. Thermal Performance: Designed for improved thermal performance, enabling higher power density and reducing the need for additional cooling components.
6. Flexible Compatibility: Can be used with a variety of control ICs, providing design flexibility for different applications.
7. Package: Typically available in a compact PQFN package, facilitating easy integration into modern circuit boards.
These features make the FDMF3180 suitable for applications requiring high power density, efficiency, and reliability.
Package
Pinout
Key functionalities include:
1. Integrated Driver and MOSFETs: Combines high-side and low-side MOSFETs with a driver.
2. Current Sensing: Provides accurate current feedback for control and protection.
3. Protection Features: Includes over-current protection (OCP), over-temperature protection (OTP), and under-voltage lockouts (UVLO).
4. Efficient Switching: Optimized for high-frequency operations, reducing power loss.
5. Fault Reporting: Communicates faults to the system controller to ensure safe operation.
These features make it suitable for high-performance computing applications where efficient power conversion is critical.
Manufacturer
Application
Equivalent
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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