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FDB2552
MOSFET N-CH 150V 5A/37A TO263AB
- Fabricante
- Mfr. Parte #FDB2552
- Paquete
- Hoja de datos FDB2552 DataSheet
- En stock10284
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Especificaciones
| Supplier | onsemi |
| Package | Tape & Reel (TR),Cut Tape (CT) |
| Series | PowerTrench® |
| ProductStatus | Active |
| FETType | N-Channel |
| Technology | MOSFET (Metal Oxide) |
| DraintoSourceVoltage(Vdss) | 150 V |
| Current-ContinuousDrain(Id)@25°C | 5A (Ta), 37A (Tc) |
| DriveVoltage(MaxRdsOnMinRdsOn) | 6V, 10V |
| RdsOn(Max)@IdVgs | 36mOhm @ 16A, 10V |
| Vgs(th)(Max)@Id | 4V @ 250µA |
| GateCharge(Qg)(Max)@Vgs | 51 nC @ 10 V |
| Vgs(Max) | ±20V |
| InputCapacitance(Ciss)(Max)@Vds | 2800 pF @ 25 V |
| PowerDissipation(Max) | 150W (Tc) |
| OperatingTemperature | -55°C ~ 175°C (TJ) |
| MountingType | Surface Mount |
| SupplierDevicePackage | D²PAK (TO-263) |
Descripción general
Description
Features
1. Port Configuration: Typically offers multiple 10/100/1000 Mbps Ethernet ports, supporting both copper and fiber connections.
2. Layer 2 Management: Supports features like VLAN, Spanning Tree Protocol (STP), and Link Aggregation for efficient network management.
3. Reliability: Built to withstand harsh operating conditions, with a wide temperature range and robust housing.
4. Power Supply Options: Often equipped with redundant power inputs for enhanced reliability.
5. Ease of Use: Web-based management interface for simple configuration and monitoring.
6. Security Features: Includes options for port security and access control lists to safeguard the network.
7. Industrial Standards Compliance: Meets various certifications ensuring reliability in industrial applications.
8. Compact Design: Space-efficient, facilitating installation in constrained environments.
These features make the FDB2552 suitable for applications in manufacturing, transportation, and other industrial sectors.
Package
Pinout
1. Gate1 (G1): Controls the first MOSFET.
2. Drain1 (D1): Drain terminal for the first MOSFET.
3. Source1 (S1): Source terminal for the first MOSFET.
4. Gate2 (G2): Controls the second MOSFET.
5. Drain2 (D2): Drain terminal for the second MOSFET.
6. Source2 (S2): Source terminal for the second MOSFET.
7. Common (COM): Ground reference for the device.
8. Thermal Pad (TP): Provides heat dissipation.
The FDB2552 is often used in applications such as power supplies, DC-DC converters, and battery management systems, enabling efficient switching and thermal performance.
Manufacturer
Application
Equivalent
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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