F3L150R07W2E3_B11

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F3L150R07W2E3_B11

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  • Mfr. Parte #F3L150R07W2E3_B11
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  • En stock9062

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Especificaciones

Package / Case Module
Minimum Operating Temperature - 40 C
Maximum Operating Temperature + 150 C
Brand Infineon Technologies
Product Type IGBT Modules
Subcategory IGBTs
Series Trenchstop IGBT3
Mounting Style SMD/SMT
Factory Pack Quantity:Factory Pack Quantity 15
Technology Si
Product IGBT Modules
Configuration 3-Phase Inverter
Collector- Emitter Voltage VCEO Max 650 V
Collector-Emitter Saturation Voltage 1.45 V
Continuous Collector Current at 25 C 150 A
Gate-Emitter Leakage Current 400 nA
Pd - Power Dissipation 335 W
Maximum Gate Emitter Voltage 20 V
Part # Aliases SP000638568 F3L150R07W2E3B11BOMA1
Packaging Tray
Tradename EasyPACK
Unit Weight 1.375685 oz
REACH - SVHC Details

Descripción general

Description

The term "F3L150R07W2E3_B11" likely refers to a specific model or designation, potentially in the context of electronics, machinery, or a specialized component. While the exact meaning may vary based on the industry, such alphanumeric designations typically include information about the product type, specifications, or version.
For instance, "F3" might denote a series or family of products, "L150" could indicate a power rating or size, "R07" might refer to a specific variant or feature, and "W2E3_B11" could signify additional specifications, revisions, or compatibility details.
To gain a thorough understanding, it would be advisable to refer to the manufacturer's documentation or a technical datasheet, as these resources would provide precise details about the product's applications, specifications, and operational guidelines. If you have a specific context or industry in mind, please provide more details for a more tailored response.

Features

The F3L150R07W2E3_B11 is a type of power semiconductor device, specifically a IGBT (Insulated Gate Bipolar Transistor) module, commonly used in industrial applications such as motor drives, renewable energy systems, and power electronics. Key features typically include:
1. Voltage Rating: Designed for high voltage applications, often rated at 1500V.
2. Current Rating: Capability to handle significant current loads, often around 150A.
3. Ruggedness: Built to withstand high thermal and electrical stresses, ensuring reliability.
4. Low Switching Loss: Enhanced efficiency due to reduced energy loss during switching operations.
5. Thermal Performance: Good thermal management features, allowing for effective heat dissipation.
6. Compact Design: Space-efficient packaging for ease of integration into various systems.
7. Applications: Suitable for renewable energy (like solar inverters), industrial drives, and UPS systems.
These features contribute to the module’s effectiveness in high-efficiency power conversion applications.

Package

The F3L150R07W2E3_B11 is available in a TO-247 package type. This package is designed for high-power applications, providing robust thermal performance and electrical insulation.

Pinout

The F3L150R07W2E3_B11 is a power transistor from the Infineon CoolSiC™ series, specifically designed for various high-efficiency applications. It typically features a pin count of 6. The primary functions of this device include efficient switching and controlling of high power in applications such as motor drives, power converters, and renewable energy systems.
The pins generally include gate, source, and drain connections, allowing for integration into diverse circuit designs. These devices are optimized for performance in high-temperature environments and are used in industrial and automotive applications. Always refer to the specific datasheet for detailed pin configuration and electrical specifications for precise applications.

Manufacturer

The F3L150R07W2E3_B11 is a power semiconductor module manufactured by Infineon Technologies AG. Infineon is a leading global semiconductor company headquartered in Neubiberg, Germany. The company specializes in designing and producing a wide range of semiconductor solutions, including those for automotive, industrial, and communication applications. Infineon is known for its innovations in power management and energy efficiency, making it a key player in the semiconductor industry. The F3L150R07W2E3_B11 module is typically used in applications such as motor drives, renewable energy systems, and industrial automation, highlighting Infineon's focus on high-performance and reliable electronic components.

Application

The F3L150R07W2E3_B11 is a power semiconductor device, specifically an IGBT (Insulated Gate Bipolar Transistor). Its application areas include industrial motor drives, renewable energy systems (like solar inverters), traction drives for electric vehicles, and power supplies. It's used in high-efficiency power conversion applications due to its ability to handle high voltage and current, making it suitable for various energy management solutions.

Equivalent

The F3L150R07W2E3_B11 is an IGBT module. Equivalent products include the F3L150R07W2E1, F3L150R07W2E4, and other similar IGBT modules from manufacturers such as Infineon, Mitsubishi, and Semikron that match its specifications (voltage, current rating, package type). Always verify compatibility and specifications for your specific application.

Envío

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Referencia de tarifas de envío (DHL/FedEx):

DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.

FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.

Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.

Pagos

Payment Methods

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Actualmente, solo aceptamos los siguientes métodos de pago:

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2. Tarjeta de crédito/débito

3. Transferencia bancaria