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EP4SGX110FF35I4G
IC FPGA 372 I/O 1152FBGA
- Fabricante
- Mfr. Parte #EP4SGX110FF35I4G
- Paquete
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Especificaciones
| Series | Stratix® IV GX |
| Part Status | Active |
| DigiKey Programmable | Not Verified |
| Number of Logic Elements/Cells | 105600 |
| Total RAM Bits | 9793536 |
| Number of I/O | 372 |
| Voltage - Supply | 0.87V ~ 0.93V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 1152-BBGA, FCBGA |
| Supplier Device Package | 1152-FBGA (35x35) |
| Base Product Number | EP4SGX110 |
| Number of LABs/CLBs | 4224 |
Descripción general
Description
Additionally, the EP4SGX110FF35I4G supports a range of I/O standards and protocols, providing flexibility and compatibility with various systems. It also includes embedded memory blocks, which are crucial for data storage and processing tasks. The device is housed in an FBGA package, which allows for efficient heat dissipation and reliability in operation. Overall, the EP4SGX110FF35I4G is targeted towards applications requiring intensive computation and high-speed communication, offering robust support for complex system designs.
Features
1. Logic Elements: It contains 110,000 logic elements, enabling complex digital circuit implementations.
2. Transceivers: It offers up to 8 integrated high-speed transceivers, each capable of up to 8.5 Gbps, suitable for high-bandwidth data processing.
3. Memory: The FPGA provides 6,840 Kbits of embedded memory, facilitating efficient data storage and retrieval.
4. IO Pins: It features a large number of general-purpose I/O pins for interfacing with various peripheral devices.
5. DSP Blocks: The device integrates DSP blocks for signal processing tasks such as filtering and modulation.
6. Power Efficiency: Designed for reduced power consumption, it supports power management features to optimize power usage.
7. Package: It comes in a 35mm x 35mm FCBGA package, which aids in thermal management and compact design integration.
These features make it suitable for applications in telecommunications, military, and other areas requiring high-speed data processing and flexibility.
Package
Pinout
Manufacturer
Intel Corporation is a multinational corporation and technology company headquartered in Santa Clara, California. It is a leading manufacturer of semiconductor chips and is well-known for its microprocessors, which are widely used in personal computers and servers. Intel's product portfolio spans various technologies, including CPUs, chipsets, integrated graphics, and FPGAs, among others. FPGAs, like the EP4SGX110FF35I4G, are integrated circuits that can be programmed after manufacturing to perform a variety of tasks, making them versatile for applications in telecommunications, data centers, automotive, and industrial sectors.
Application
Equivalent
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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