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EP3SL50F484C3N
IC FPGA 296 I/O 484FBGA
- Fabricante
- Mfr. Parte #EP3SL50F484C3N
- Paquete FBGA-484
- Hoja de datos
- En stock4697
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Especificaciones
| Package | Tray |
| Series | Stratix® III L |
| ProductStatus | Obsolete |
| NumberofLABs/CLBs | 1900 |
| NumberofLogicElements/Cells | 47500 |
| TotalRAMBits | 2184192 |
| NumberofI/O | 296 |
| Voltage-Supply | 0.86V ~ 1.15V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 484-BBGA, FCBGA |
Descripción general
Description
Key aspects of the EP3SL50F484C3N include:
1. Architecture: Built on a 65nm process technology, it offers high density and performance while reducing power consumption.
2. I/O Capabilities: Supports various I/O standards, making it versatile for different interfacing needs.
3. Memory: Incorporates embedded memory blocks for efficient data storage and processing.
4. DSP Blocks: Features dedicated Digital Signal Processing (DSP) blocks for high-speed arithmetic operations.
5. Development Tools: Compatible with Intel’s Quartus Prime design software, facilitating design and implementation processes.
This FPGA is suitable for applications that require flexibility, high performance, and advanced processing capabilities.
Features
1. Logic Capacity: Offers 50,000 logic elements (LEs), enabling complex designs.
2. Embedded Memory: Includes up to 1.2 Mbits of embedded memory blocks, supporting efficient data storage.
3. DSP Blocks: Features dedicated DSP (Digital Signal Processing) blocks for enhanced signal processing tasks.
4. I/O Support: Supports multiple I/O standards, including LVDS and SSTL, with up to 36 dedicated I/O pins.
5. Configuration Options: Can be configured via JTAG or other methods, facilitating easy design updates.
6. Power Management: Offers low power consumption modes suitable for energy-efficient designs.
7. High-Speed Performance: Capable of operating at high clock frequencies, making it suitable for demanding applications.
Ideal for telecommunications, automotive, and industrial control applications, the EP3SL50F484C3N combines flexibility with robust performance.
Package
Pinout
The functions of these pins include:
- I/O pins for general-purpose input and output.
- Configurable pins that support various protocols (such as LVDS, PCI Express, etc.).
- Power supply pins for core and I/O voltages.
- Ground pins for proper electrical grounding.
This FPGA is designed for high-performance applications, offering a combination of logic elements, memory blocks, and digital signal processing capabilities. The specific pin assignments and their functions can be found in the device's datasheet, which provides detailed information about I/O standards, power distribution, and package dimensions.
Manufacturer
Application
Equivalent
1. Xilinx Spartan-6 series (e.g., XC6SLX50)
2. Lattice ECP3 series (e.g., LFE3-50EA)
3. Microsemi SmartFusion or IGLOO series
When selecting an equivalent, consider factors like logic cells, I/O count, and specific application requirements.
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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