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EP3C40F324C8N
IC FPGA 195 I/O 324FBGA
- Fabricante
- Mfr. Parte #EP3C40F324C8N
- Paquete FBGA-324
- Hoja de datos
- En stock3397
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Especificaciones
| Package | Tray |
| Series | Cyclone® III |
| ProductStatus | Active |
| NumberofLABs/CLBs | 2475 |
| NumberofLogicElements/Cells | 39600 |
| TotalRAMBits | 1161216 |
| NumberofI/O | 195 |
| Voltage-Supply | 1.15V ~ 1.25V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 324-BGA |
Descripción general
Description
With its built-in memory blocks and DSP (Digital Signal Processing) capabilities, the EP3C40F324C8N is ideal for applications in communications, consumer electronics, and automotive systems. It provides a high degree of flexibility, allowing developers to implement custom logic and accelerate design processes. The device is housed in a 324-pin BGA package, facilitating efficient thermal management and space-saving design.
Overall, the EP3C40F324C8N is a powerful and cost-effective solution for engineers looking to leverage FPGA technology in their designs.
Features
1. Logic Elements: Approximately 40,000 logic elements, enabling complex designs.
2. Memory: Up to 1,152 Kbits of embedded memory blocks, supporting various configurations.
3. I/O Capability: Offers 324 I/O pins with flexible I/O standards, suitable for a wide range of interfaces.
4. DSP Blocks: Contains up to 80 dedicated DSP blocks for efficient digital signal processing.
5. Low Power Consumption: Designed for low power operation, ideal for portable and battery-operated applications.
6. Configuration: Supports various configuration modes, including JTAG and ActiveSerial.
7. Fast Design Implementation: Integrated with Intel's Quartus Prime software for streamlined design and development.
This FPGA is well-suited for applications in industrial automation, communications, and consumer electronics, offering a balance of performance and cost-efficiency.
Package
Pinout
The primary functions of the EP3C40F324C8N include:
- Logic Functions: It provides configurable logic blocks (CLBs) for implementing custom logic circuitry.
- I/O Interfaces: The device supports various I/O standards, enabling connections to external components and systems.
- Embedded Memory: It includes embedded memory blocks for data storage.
- Digital Signal Processing (DSP): It has dedicated DSP blocks for efficient processing of digital signals.
- Clock Management: It features clock management resources, including phase-locked loops (PLLs) and clock dividers.
The EP3C40F324C8N is suitable for a wide range of applications in communications, automotive, industrial control, and consumer electronics.
Manufacturer
Intel is one of the largest and most influential players in the semiconductor industry, focusing on innovation in computing technology. The company operates in markets such as data centers, artificial intelligence, and the Internet of Things (IoT), among others. With a strong emphasis on research and development, Intel continues to push the boundaries of technology to support evolving computing needs.
Application
Equivalent
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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