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EP3C25F324I7
IC FPGA 215 I/O 324FBGA
- Fabricante
- Mfr. Parte #EP3C25F324I7
- Paquete
- Hoja de datos
- En stock9278
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Especificaciones
| Series | Cyclone® III |
| Part Status | Active |
| DigiKey Programmable | Not Verified |
| Total RAM Bits | 608256 |
| Number of I/O | 215 |
| Voltage - Supply | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 324-BGA |
| Supplier Device Package | 324-FBGA (19x19) |
| Base Product Number | EP3C25 |
| Number of Logic Elements/Cells | 24624 |
| Number of LABs/CLBs | 1539 |
Descripción general
Description
Key specifications include a maximum operating frequency of around 200 MHz, support for multiple I/O standards, and a range of configurable I/O pins. The FPGA supports various design methodologies, including hardware description languages like VHDL and Verilog, allowing for flexible design implementations.
The EP3C25F324I7 also offers built-in memory resources, including RAM blocks, and is compatible with various development tools and intellectual property (IP) cores. The device is packaged in a 324-pin fine-pitch ball grid array (FBGA) for efficient thermal and electrical performance. Overall, it is a versatile choice for engineers looking for a balance of performance and cost in FPGA solutions.
Features
1. Logic Elements: It contains approximately 25,000 logic elements, supporting a range of complex designs.
2. Memory: Features up to 1.5 Mbits of embedded memory, including support for various data storage configurations.
3. I/O Pins: Offers up to 324 user I/O pins, allowing flexible interfacing with other components.
4. Performance: Capable of operating at high frequencies (up to 200 MHz) for efficient processing.
5. Power Efficiency: Designed to consume low power, making it suitable for battery-powered and thermal-sensitive applications.
6. Configuration: Supports multiple configuration schemes, including JTAG and passive serial, enhancing design flexibility.
7. Development Support: Compatible with Intel Quartus Prime software for easier design implementation and debugging.
These features make the EP3C25F324I7 ideal for applications in telecommunications, automotive, and consumer electronics.
Package
Pinout
The main functions of the EP3C25F324I7 include:
1. Configurable Logic Blocks (CLBs): Used for implementing custom logic functions.
2. Memory Elements: Includes embedded memory blocks for data storage.
3. I/O Pins: Supports various I/O standards for interfacing with other devices.
4. DSP Blocks: Optimized for digital signal processing applications.
5. Clock Management: Features PLLs (Phase-Locked Loops) for clock generation and management.
The device is suitable for applications such as telecommunications, automotive, and industrial control systems, where flexibility and performance are crucial.
Manufacturer
Application
Equivalent
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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