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EP2AGX65DF29I3G
IC FPGA 364 I/O 780FBGA
- Fabricante
- Mfr. Parte #EP2AGX65DF29I3G
- Paquete FBGA-780
- Hoja de datos
- En stock4686
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Especificaciones
| Package | Tray |
| Series | Arria II GX |
| ProductStatus | Active |
| NumberofLABs/CLBs | 2530 |
| NumberofLogicElements/Cells | 60214 |
| TotalRAMBits | 5371904 |
| NumberofI/O | 364 |
| Voltage-Supply | 0.87V ~ 0.93V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 780-BBGA, FCBGA |
Descripción general
Description
Key specifications include:
- Logic Elements: Approximately 65,000 adaptive logic elements (LEs), enabling complex logic operations.
- Memory: Supports embedded memory blocks and high-speed memory interfaces.
- Processing: Offers high-speed DSP (Digital Signal Processing) capabilities, making it suitable for signal processing applications.
- I/O Flexibility: Provides a range of I/O standards and high-speed transceivers, suitable for various connectivity options.
- Power Efficiency: Designed for lower power consumption while delivering high performance.
The EP2AGX65DF29I3G is ideal for applications demanding high throughput, low latency, and adaptability, making it a versatile choice for engineers looking to implement custom hardware solutions.
Features
1. Architecture: Utilizes a 2D mesh architecture for high performance and efficiency.
2. Logic Elements: Contains up to 65,000 logic elements (LEs) for complex design implementations.
3. Memory: Integrated with various on-chip memory options, including M10K memory blocks.
4. DSP Blocks: Features high-performance DSP blocks optimized for signal processing applications.
5. I/O Support: Supports a wide range of I/O standards, enabling versatility in interfacing with different systems.
6. Power Management: Advanced power management features for optimized energy consumption.
7. High-Speed Transceivers: Includes high-speed transceivers for data communication.
8. Development: Supported by Intel’s software tools for design and programming, facilitating efficient development.
This FPGA is suitable for applications in data centers, communications, and industrial automation, where flexibility and performance are crucial.
Package
Pinout
The primary functions of the pins include power supply, ground, configuration, and general-purpose I/O. It also supports dedicated pins for user-defined functions, clock inputs, and JTAG for programming and debugging. The pin configuration allows flexibility in designing digital circuits for various applications, including communications, automotive, and industrial systems. Overall, the EP2AGX65DF29I3G provides a versatile platform for custom digital logic implementations.
Manufacturer
Application
Equivalent
1. Xilinx Artix-7 series
2. Lattice ECP5 series
3. Microsemi SmartFusion2
These alternatives offer similar performance and functionality for applications in digital signal processing and communication. Always verify specific requirements and compatibility for your project.
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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