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EMMC32G-IX29-8AC01
EMMC 5.1 (HS400) 153B 32GB - IND
- Fabricante
- Mfr. Parte #EMMC32G-IX29-8AC01
- Paquete BGA-153
- Hoja de datos
- En stock3356
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Especificaciones
| Package | Tray |
| Series | I-Temp e•MMC™ |
| ProductStatus | Active |
| MemoryType | Non-Volatile |
| MemoryFormat | FLASH |
| Technology | FLASH - NAND (TLC) |
| MemorySize | 256Gb (32G x 8) |
| MemoryInterface | eMMC |
| Voltage-Supply | 1.8V ~ 3.3V |
| OperatingTemperature | -40°C ~ 85°C (TA) |
| MountingType | Surface Mount |
| Package/Case | 153-BGA |
Descripción general
Description
Key points:
- Capacity: 32 GB. Interface: standard eMMC/MMC bus (8-bit data bus, command/response protocol) to the host processor.
- Power/operating: typically 2.7–3.6 V supply; temperature range and exact voltages depend on the specific variant.
- Features: built-in bad-block management, wear leveling, ECC/error handling; supports firmware updates and typical eMMC features (vary by vendor).
- Package: usually a BGA or similar embedded package; designed for motherboard/PCB integration.
- Applications: automotive ECUs, industrial controllers, single-board computers, handheld/embedded devices.
For precise specs (read/write speeds, endurance, exact voltage ranges, temperature range, package type, pinout), consult the official datasheet from the manufacturer or the supplier for part number EMMC32G-IX29-8AC01. If you share the vendor or a datasheet link, I can extract the exact figures.
Features
- Capacity: 32 GB embedded MMC (eMMC) flash with on-board controller
- Standard: JEDEC eMMC 5.x compliant (5.0/5.1 families)
- Interface: 8-bit wide MMC interface; High-Speed modes up to 52 MHz (HS); supports DDR modes (HS200/HS400) on newer revisions
- Secure features: RPMB (Replay Protected Memory Block) for secure storage; boot partitions with read/write protection
- Reliability: on-die ECC, Bad Block Management (BBM), wear leveling
- Performance: multi-plane operations and command handling optimized for sequential and random I/O
- Power/weight: optimized for embedded/mobile use with low-power design
- Integration: no external NAND controller required; single-chip solution
Note: For exact speed ratings, voltage ranges, temperature range, and packaging, consult the device’s official datasheet.
Package
Application
- Mobile/embedded devices needing internal storage: smartphones, tablets, cameras, wearables
- Automotive: infotainment, telematics
- Industrial/embedded systems: automation controllers, POS, medical devices
- Consumer electronics: smart TVs, set-top boxes, game consoles, IP cameras
- IoT/edge: gateways, sensors, drones, robotics
Equivalent
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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