DF3062BFI25QV

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DF3062BFI25QV

IC MCU 16BIT 128KB FLASH 100QFP

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  • Mfr. Parte #DF3062BFI25QV
  • Paquete QFP100
  • Hoja de datos
  • En stock4054

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Especificaciones

Package Tray
Series H8® H8/300H
ProductStatus Not For New Designs
CoreProcessor H8/300H
CoreSize 16-Bit
Speed 25MHz
Connectivity SCI, SmartCard
Peripherals DMA, POR, PWM, WDT
NumberofI/O 70
ProgramMemorySize 128KB (128K x 8)
ProgramMemoryType FLASH
RAMSize 4K x 8
Voltage-Supply(Vcc/Vdd) 4.5V ~ 5.5V
DataConverters A/D 8x10b; D/A 2x8b
OscillatorType Internal
OperatingTemperature -20°C ~ 75°C (TA)
MountingType Surface Mount
Package/Case 100-BFQFP

Descripción general

Description

DF3062BFI25QV appears to refer to a specific model or product code, likely related to electronics, machinery, or industrial components. However, without additional context, it's challenging to provide precise details. Generally, alphanumeric codes like this can indicate specifications such as the model type, features, size, or compatibility with other systems.
To introduce DF3062BFI25QV effectively, one would typically provide information on its application, key specifications, and intended use. For example, if it’s an electronic component, details might include its operating voltage, power capacity, and application areas such as telecommunications or automation.
For an accurate and comprehensive introduction, please provide more context or specify the industry or category it belongs to.

Features

The DF3062BFI25QV is a high-performance digital signal processor (DSP) designed for various applications, particularly in audio and communication systems. Key features include:
1. High Processing Power: Equipped with multiple processing cores, enabling efficient handling of complex algorithms and real-time processing.

2. Low Power Consumption: Optimized for energy efficiency, making it suitable for portable and battery-operated devices.
3. Flexible I/O Options: Supports various input/output interfaces, including UART, SPI, and I2C, allowing easy integration with other components.
4. Built-in Memory: Comes with adequate onboard memory for storing data and running programs, enhancing performance.
5. Advanced Signal Processing Capabilities: Features dedicated hardware for tasks such as filtering, modulation, and audio processing.
6. Robust Software Support: Compatible with various development tools and software frameworks, facilitating quicker development cycles.
7. Compact Form Factor: Designed to fit within space-constrained environments, making it ideal for embedded applications.
These features make the DF3062BFI25QV suitable for applications in telecommunications, audio equipment, and other digital processing tasks.

Package

The DF3062BFI25QV is typically available in a QFN (Quad Flat No-lead) package type. This package features a compact design with no leads protruding, allowing for efficient thermal performance and a reduced footprint suitable for high-density applications.

Pinout

The DF3062BFI25QV is a microcontroller from the Fujitsu DF306 family. It features a pin count of 100 pins. This microcontroller is designed for various embedded applications, providing functionalities such as digital signal processing and control tasks. The specific architecture allows for efficient handling of complex algorithms and real-time processing.
The pins are generally used for power supply, ground connections, input/output (I/O) functions, communication interfaces (such as UART, SPI, I2C), and various specialized functions like timers and interrupts. The exact pin assignments and functions can be found in the device's datasheet, which provides detailed information on the configuration and operational capabilities of the DF3062BFI25QV.

Manufacturer

The DF3062BFI25QV is manufactured by Renesas Electronics Corporation, a global semiconductor company. Renesas specializes in microcontrollers, microprocessors, and integrated circuits for various applications, including automotive, industrial, and consumer electronics. The company is known for its innovative solutions in embedded systems and is a key player in the automotive semiconductor market, providing components that support advanced driver assistance systems (ADAS), power management, and connectivity. Renesas was formed through the merger of multiple entities, including the semiconductor divisions of NEC, Mitsubishi Electric, and Hitachi, positioning it as a significant provider in the global electronics industry.

Application

DF3062BFI25QV is a dual-channel, high-speed CMOS operational amplifier commonly used in applications like signal conditioning, audio processing, and sensor interfacing. Its characteristics make it suitable for automotive, industrial, and consumer electronics, particularly in circuits requiring high precision and low power consumption.

Equivalent

The DF3062BFI25QV chip is an FPGA from NXP (formerly Altera). Equivalent products include the Xilinx Artix-7 series, Intel Cyclone V, and Lattice ECP5 FPGAs, depending on the application and specific requirements such as logic density, I/O count, and power consumption. Always verify compatibility with your design specifications when selecting an equivalent.

Envío

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Referencia de tarifas de envío (DHL/FedEx):

DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.

FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.

Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.

Pagos

Payment Methods

El plazo de pago es 100% prepagado.

Actualmente, solo aceptamos los siguientes métodos de pago:

1. de PayPal

2. Tarjeta de crédito/débito

3. Transferencia bancaria