CYW20702B0KWFBGT

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CYW20702B0KWFBGT

IC RF TxRx + MCU Bluetooth Bluet

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  • Mfr. Parte #CYW20702B0KWFBGT
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Especificaciones

Part Status Active
Packaging Tape & Reel (TR)

Descripción general

Description

CYW20702B0KWFBGT is a Cypress/Infineon dual‑mode Bluetooth wireless SoC/module in the CYW20702 family. It combines a 2.4 GHz radio, an ARM Cortex‑M0 MCU, flash and RAM, and the Bluetooth stack on a single device, designed to be embedded in consumer electronics.
Key points:
- Dual‑mode Bluetooth: Classic + LE, suitable for a wide range of devices.
- Pre‑certified: Includes regional radio approvals to simplify regulatory work.
- Interfaces: Host MCU communicates via UART or SPI with GPIOs; software stack (GAP/GATT, profiles) runs on the integrated MCU.
- Software: Supported by Cypress/WICED or ModusToolbox toolchains and SDKs for building Bluetooth apps.
- Packaging/variant: KWFBGT denotes a specific packaging, temperature rating, and regional variant.
Typical use cases include wearables, audio accessories, and IoT devices needing embedded Bluetooth connectivity. Development involves selecting the SDK, configuring the Bluetooth roles/services, and flashing the device through the programming interface.

Features

CYW20702B0KWFBGT features:
- 2.4 GHz Bluetooth Low Energy radio with Bluetooth 5.x capabilities
- Integrated microcontroller with on-chip ROM/RAM
- Flexible peripherals: GPIO, UART, SPI, I2C, I2S/PCM, PWM, ADC, DAC (and PDM where supported)
- Crypto engine with secure boot and device protection; OTA/DFU support
- Low-power design with multiple sleep modes for wearables/IoT
- Small footprint packaging: KWFBGT variant (compact QFN)
- Development support via Cypress ModusToolbox/SDK and related toolchains
Note: exact CPU core, RAM/ROM sizes, and feature details may vary by revision; consult the datasheet for precise specs.

Package

FBGA (Fine Ball Grid Array) package. For exact ball count and dimensions, please refer to the CYW20702B0 datasheet.

Pinout

Pin count: 48-pin QFN/package.
Function: Cypress Infineon CYW20702B0 is a Bluetooth Low Energy (BLE) System-on-Chip (SoC) with an integrated 2.4 GHz transceiver and MCU (ARM Cortex-M0+). It provides BLE connectivity and standard peripherals (GPIOs, UART/SPI/I2C, timers, etc.) for wireless IoT/wearable applications.

Manufacturer

Manufacturer: Cypress Semiconductor Corporation (now part of Infineon Technologies AG).
What kind of company: A semiconductor company that designs and manufactures integrated circuits and system-on-chip solutions, including microcontrollers, memory, and wireless (Bluetooth) SoCs for consumer electronics, IoT, and automotive applications.

Application

- True Wireless Stereo (TWS) earbuds
- Bluetooth audio headsets and headphones
- Wireless audio adapters/dongles and hands-free car kits
- Voice-enabled wearables and smart accessories
- Portable speakers and other audio streaming devices

Envío

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Referencia de tarifas de envío (DHL/FedEx):

DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.

FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.

Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.

Pagos

Payment Methods

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Actualmente, solo aceptamos los siguientes métodos de pago:

1. de PayPal

2. Tarjeta de crédito/débito

3. Transferencia bancaria

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