CSR8675C-ICXT-R

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CSR8675C-ICXT-R

IC RF TXRX+MCU BLE 79WLCSP

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Especificaciones

Series BlueCore®
Part Status Obsolete
Base Product Number CSR8675
DigiKey Programmable Not Verified
Type TxRx + MCU
RF Family/Standard Bluetooth
Protocol Bluetooth v4.2
Frequency 2.4GHz
Power - Output 8.5dBm
Sensitivity -90dBm
Memory Size 16MB Flash
Serial Interfaces I2S
Voltage - Supply 3.3V
Mounting Type Surface Mount
Package 79-UFBGA, WLCSP
Supplier Device Package 79-WLCSP (4.73x4.84)
Packaging Cut Tape (CT), Tape & Reel (TR)
GPIO 2

Descripción general

Description

The CSR8675C-ICXT-R is a high-performance, low-power Bluetooth audio SoC (System on Chip) designed by Qualcomm. It is part of the CSR8675 series, known for enabling advanced audio applications and wireless connectivity in devices such as wireless headphones, speakers, and other audio peripherals. This chip supports Bluetooth 4.2 and includes Qualcomm's aptX audio technology, which ensures high-quality audio streaming with minimal delay.
The CSR8675C-ICXT-R features a dual-core 80MHz DSP and a variety of integrated features such as active noise cancellation, voice recognition, and multipoint connections, allowing seamless pairing with multiple devices. Its low power consumption makes it ideal for battery-powered applications, enhancing battery life while maintaining robust performance. Additionally, the chip supports various audio codecs, including SBC, AAC, and aptX, ensuring compatibility with different devices and audio formats.
Overall, the CSR8675C-ICXT-R provides a versatile, high-quality solution for manufacturers looking to implement advanced Bluetooth audio capabilities in their products.

Features

The CSR8675C-ICXT-R is a highly integrated audio system-on-chip designed by Qualcomm for premium audio applications. Here are some of its key features:
1. Bluetooth Audio: Supports Bluetooth 4.2, offering high-quality wireless audio transmission with aptX, aptX HD, and AAC codecs for enhanced sound quality.
2. Audio Processing: Includes a 120 MIPS Kalimba DSP for advanced audio processing tasks, enabling features like active noise cancellation, echo cancellation, and audio enhancements.
3. High-Resolution Audio: Capable of 24-bit audio processing and sampling rates up to 192 kHz, making it suitable for high-resolution audio playback.
4. Voice Assistance: Provides support for voice-activated virtual assistants, improving user interaction through voice commands.
5. Low Power Consumption: Designed for low power usage, extending battery life in portable applications.
6. Integrated DAC: Features a high-performance DAC for superior sound output quality.
7. Multi-core Architecture: Combines a dual-core MCU with a DSP, enabling efficient task handling and audio processing.
8. Connectivity: Offers I2S, PCM, and SPDIF interfaces for audio data transfer and connection to various peripherals.
Overall, the CSR8675C-ICXT-R is ideal for high-end wireless headsets, speakers, and other audio products requiring robust Bluetooth connectivity and advanced audio processing capabilities.

Package

The CSR8675C-ICXT-R is a semiconductor package typically available in a quad flat no-leads (QFN) package type. This package type is compact and offers efficient heat dissipation, making it ideal for high-performance Bluetooth audio applications.

Pinout

The CSR8675C-ICXT-R is a highly integrated Bluetooth audio SoC (System on Chip) from Qualcomm, designed for high-quality wireless audio applications. It typically comes in a 0.5mm pitch 5x5mm QFN package. The pin count is usually 80 pins, although the specifics can vary slightly based on the configuration and manufacturer specifications.
The main functions of the CSR8675 include:
1. Bluetooth Audio Processing: Supports aptX, aptX HD, and AAC codecs for high-fidelity audio streaming.
2. Digital Signal Processing: Built-in DSP for audio enhancements and processing, enabling noise reduction and echo cancellation.
3. Wireless Connectivity: Supports Bluetooth 4.2 with EDR and low energy features for efficient wireless communication.
4. Audio Interfaces: Provides I2S, PCM, and SPDIF interfaces for audio data transmission.
5. Power Management: Integrated power management functionality for optimized battery usage.
6. Voice Commands: Supports voice command interfaces, making it suitable for smart devices and AI applications.
For detailed pin functions and configurations, you should refer to the official datasheet or technical documentation provided by the manufacturer.

Manufacturer

The CSR8675C-ICXT-R is manufactured by Qualcomm. Qualcomm is an American multinational corporation known for its role in designing and manufacturing semiconductor products and services related to wireless communication. It specializes in developing and supplying integrated circuits for mobile devices, networking, automotive systems, and other electronic products. Qualcomm is particularly well-known for its Snapdragon processors used in many smartphones and its contributions to advancing wireless technologies, including 3G, 4G, and the ongoing development of 5G networks.

Application

The CSR8675C-ICXT-R is a Bluetooth audio chip designed for high-quality wireless audio applications. Key application areas include wireless headphones, earbuds, and speakers, where it enables features such as aptX HD audio, noise cancellation, and voice assistant integration. It is also used in automotive audio systems and home entertainment devices to provide seamless Bluetooth connectivity and superior sound performance.

Equivalent

The CSR8675C-ICXT-R is a Qualcomm Bluetooth audio SoC optimized for wireless audio applications. Equivalent products could include the Qualcomm QCC5124, which offers advanced Bluetooth audio capabilities, and the Nordic Semiconductor nRF5340, which provides robust connectivity solutions. Additionally, the Texas Instruments CC2564MODA is a strong contender for Bluetooth audio applications. These alternatives vary in features and specifications, so compatibility with specific project requirements should be considered.

Envío

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Referencia de tarifas de envío (DHL/FedEx):

DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.

FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.

Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.

Pagos

Payment Methods

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