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CSD16406Q3
MOSFET N-CH 25V 19A/60A 8VSON
- Fabricante
- Mfr. Parte #CSD16406Q3
- Paquete
- Hoja de datos
- En stock6614
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Especificaciones
| Package | Tape & Reel (TR),Cut Tape (CT) |
| Series | NexFET™ |
| ProductStatus | Active |
| FETType | N-Channel |
| Technology | MOSFET (Metal Oxide) |
| DraintoSourceVoltage(Vdss) | 25 V |
| Current-ContinuousDrain(Id)@25°C | 19A (Ta), 60A (Tc) |
| DriveVoltage(MaxRdsOnMinRdsOn) | 4.5V, 10V |
| RdsOn(Max)@IdVgs | 5.3mOhm @ 20A, 10V |
| Vgs(th)(Max)@Id | 2.2V @ 250µA |
| GateCharge(Qg)(Max)@Vgs | 8.1 nC @ 4.5 V |
| Vgs(Max) | +16V, -12V |
| InputCapacitance(Ciss)(Max)@Vds | 1100 pF @ 12.5 V |
| PowerDissipation(Max) | 2.7W (Ta) |
| OperatingTemperature | -55°C ~ 150°C (TJ) |
| MountingType | Surface Mount |
| SupplierDevicePackage | 8-VSON-CLIP (3.3x3.3) |
Descripción general
Description
Features
1. Low On-Resistance: It offers a low R_DS(on) value, enhancing efficiency by minimizing conduction losses.
2. High Voltage Rating: Suitable for applications requiring high voltage capabilities, ensuring reliability under demanding conditions.
3. Fast Switching Speed: This MOSFET supports rapid switching, making it ideal for high-frequency applications like DC-DC converters.
4. Thermal Performance: With a robust thermal design, it can handle significant power dissipation, reducing the risk of overheating.
5. Surface Mount Package: Packaged in a compact SOIC-8 format, facilitating easy integration into various circuits and saving PCB space.
6. Low Gate Charge: It features low gate charge (Q_g), which helps in reducing drive losses and improving overall circuit efficiency.
These features make the CSD16406Q3 suitable for applications in power management, automotive, and renewable energy systems.
Package
Pinout
Pin Functions:
1. Gate (G): Controls the MOSFET's switching (turns it on/off).
2. Drain (D): The output terminal where the load is connected.
3. Source (S): Common reference point for the MOSFET, typically connected to ground in low-side switching applications.
4. Thermal Pad: Provides heat dissipation and needs to be soldered to the PCB for effective thermal management.
This device is designed for applications such as power management in consumer electronics and automotive systems, offering low on-resistance and fast switching capabilities.
Manufacturer
Application
Equivalent
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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