BGM220SC22WGA2

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BGM220SC22WGA2

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Especificaciones

Package Tray
ProductStatus Active
RFFamily/Standard Bluetooth
Protocol Bluetooth v5.2
Modulation GFSK
Frequency 2.4GHz ~ 2.4835GHz
DataRate 2Mbps
Power-Output 6dBm
Sensitivity -106.4dBm
SerialInterfaces ADC, I²C, I²S, PWM, SPI, IrDA, UART, USART
AntennaType Integrated, Chip
UtilizedIC/Part EFR32BG22
MemorySize 352kB Flash, 32kB RAM
Voltage-Supply 1.8V ~ 3.8V
Current-Receiving 4.2mA ~ 4.8mA
Current-Transmitting 4.6mA ~ 8.8mA
MountingType Surface Mount
OperatingTemperature -40°C ~ 85°C (TA)

Descripción general

Description

The BGM220SC22WGA2 is a part of Silicon Labs' BGM220S series, which are ultra-small, low-power Bluetooth modules designed for IoT applications. These modules are built around the EFR32BG22 SoC, providing energy efficiency and robust wireless connectivity. The BGM220SC22WGA2 is specifically aimed at applications requiring compact size and efficient performance, such as wearable devices, health and fitness trackers, and smart home products.
Key features of the BGM220SC22WGA2 include Bluetooth 5.2 support, enabling features like enhanced range and data rates. It also offers a high-performance Bluetooth radio, low-power consumption, and advanced security features, including AES-128 and secure boot. The module supports a wide range of development environments and tools, simplifying the process for developers to integrate Bluetooth connectivity into their products.
With its small footprint and low energy consumption, the BGM220SC22WGA2 is ideal for battery-operated devices where space and power efficiency are critical. It provides a reliable solution for creating connected devices with minimal impact on design and development resources.

Features

The BGM220SC22WGA2 is a compact Bluetooth module from Silicon Labs, designed for IoT applications that require energy efficiency and robust performance. Key features include:
1. Bluetooth 5.2: Supports low energy features like long-range, high throughput, and advertising extensions.
2. Processor: Equipped with a powerful Arm Cortex-M33 processor for efficient data handling and processing tasks.
3. Memory: Includes flash memory and RAM to facilitate application storage and processing.
4. Security: Features advanced security capabilities with hardware cryptography and secure boot, ensuring data integrity and secure communications.
5. Size: The compact form factor is ideal for space-constrained applications.
6. Power Efficiency: Designed for low-power operation, making it suitable for battery-operated devices.
7. Peripherals: Offers a range of peripheral interfaces like UART, I2C, SPI, and GPIOs for versatile connectivity.
8. Development Support: Compatible with Silicon Labs’ software tools and stacks, facilitating development and deployment.
9. Certification: Pre-certified for international regulatory standards, speeding up time-to-market.
These features make the BGM220SC22WGA2 suitable for smart home, health, and industrial IoT applications.

Package

The BGM220SC22WGA2 is a microcontroller package from Silicon Labs featuring a QFN32 (Quad Flat No-leads) package type. It is designed for Bluetooth Low Energy (BLE) applications, offering a compact footprint suitable for space-constrained designs.

Pinout

The BGM220SC22WGA2 is a module from Silicon Labs that integrates a Bluetooth Low Energy (BLE) system-on-chip. It typically features a compact design suitable for space-constrained applications.
The BGM220SC22WGA2 consists of 26 pins. These pins serve various functions, including:
1. Power Supply Pins: For providing the necessary power to the module.
2. Ground Pins: Used for grounding the circuit.
3. GPIO Pins: General Purpose Input/Output pins for interfacing with other hardware components.
4. Communication Interface Pins: Such as UART, SPI, or I2C, for communication with other devices.
5. RF Pins: For radio frequency signal transmission and reception.
6. Reset Pin: To reset the module.
7. Programming and Debugging Pins: For programming the device and debugging purposes.
Each of these pin functions contributes to the module's capability to support Bluetooth connectivity and interface with other peripherals, making it suitable for various IoT and embedded applications. For detailed pin configuration and specific functions, consulting the official datasheet from Silicon Labs is recommended.

Manufacturer

The BGM220SC22WGA2 is manufactured by Silicon Labs. Silicon Labs is a technology company that specializes in designing and developing semiconductors and software solutions. They focus on providing products for the Internet of Things (IoT), internet infrastructure, industrial automation, consumer electronics, and automotive markets. The company is known for its expertise in wireless technologies, microcontrollers, sensors, and other silicon solutions that enable connectivity and smart functionality in various electronic devices.

Application

The BGM220SC22WGA2 is a Bluetooth module designed for low-power IoT applications. Key application areas include smart home devices, health and fitness wearables, asset tracking, and industrial automation. It is ideal for products requiring Bluetooth connectivity with minimal power consumption, such as sensors, remote controls, and location-based services. Its small form factor and energy efficiency make it suitable for battery-powered devices.

Equivalent

The BGM220SC22WGA2 is a Bluetooth Low Energy (BLE) module from Silicon Labs. Equivalent products would typically include BLE modules from other manufacturers with similar specifications. Some alternatives could include:
1. Nordic Semiconductor's nRF52832 or nRF52840.
2. Texas Instruments' CC2640R2F.
3. Dialog Semiconductor's DA14531.
4. Microchip's RN4871.
These products offer similar BLE functionalities and might vary in terms of size, power consumption, and additional features. Always check the specific requirements and specifications to ensure compatibility.

Envío

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ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.


Referencia de tarifas de envío (DHL/FedEx):

DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.

FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.

Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.

Pagos

Payment Methods

El plazo de pago es 100% prepagado.

Actualmente, solo aceptamos los siguientes métodos de pago:

1. de PayPal

2. Tarjeta de crédito/débito

3. Transferencia bancaria