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BGA715N7E6327XTSA2
IC AMP GPS 1.55-1.615GHZ TSNP7-1
- Fabricante
- Mfr. Parte #BGA715N7E6327XTSA2
- Paquete XFDFN-6
- Hoja de datos BGA715N7E6327XTSA2 DataSheet
- En stock3009
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Especificaciones
| Package | Tape & Reel (TR),Cut Tape (CT) |
| ProductStatus | Not For New Designs |
| Frequency | 1.55GHz ~ 1.615GHz |
| Gain | 20dB |
| NoiseFigure | 0.7dB |
| RFType | GPS/GNSS |
| Voltage-Supply | 1.5V ~ 3.3V |
| Current-Supply | 3.3mA |
| TestFrequency | 1.575GHz |
| MountingType | Surface Mount |
| Package/Case | 6-XFDFN Exposed Pad |
Descripción general
Description
The component's designation suggests it comes in a Ball Grid Array (BGA) package, which provides a compact and efficient form factor ideal for modern electronic devices that require high performance in a small size. The BGA package facilitates efficient thermal management and improved electrical performance.
Applications for this type of RF amplifier might include cellular base stations, repeaters, and other wireless communication infrastructure. Its design typically ensures it can handle the demands of high-frequency operations while maintaining signal integrity and reducing power consumption. For detailed specifications, users should refer to the manufacturer's datasheet.
Features
1. Frequency Range: Supports a wide frequency range, typically from 400 MHz to 2.7 GHz, making it suitable for various wireless applications.
2. High Gain: Offers high gain, typically around 20 dB, which ensures robust signal amplification.
3. Low Noise Figure: Provides a low noise figure, enhancing signal clarity and improving receiver sensitivity.
4. Small Form Factor: Comes in a compact package, ideal for space-constrained applications.
5. Impedance Matching: Integrated impedance matching reduces the need for external components, simplifying design and reducing cost.
6. Power Supply: Operates with low power consumption, improving energy efficiency in devices.
7. Temperature Range: Can function effectively over a wide temperature range, ensuring reliability in various environmental conditions.
8. Robust Design: Offers high linearity and robustness against ESD and other environmental factors.
This RF amplifier is commonly used in mobile devices, base stations, and other communication equipment that require efficient and reliable signal amplification.
Package
Pinout
The primary function of the BGA715N7E6327XTSA2 is to serve as an RF amplifier, which boosts the signal strength for better transmission and reception in RF communication systems. It is used in frequency bands that are common in mobile communications, enhancing signal integrity and performance. This IC is typically employed in wireless communication devices to improve signal strength and quality, ensuring efficient data transmission. For precise and up-to-date pin count and detailed functional description, it is advisable to refer to the datasheet or technical documentation provided by Infineon Technologies.
Manufacturer
Application
Equivalent
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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