BCM75635RPKFEBA03G

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BCM75635RPKFEBA03G

Broadcom Limited

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Descripción general

Description

The BCM75635RPKFEBA03G is a highly integrated system-on-chip (SoC) from Broadcom, designed primarily for broadband applications. It features advanced capabilities for processing high-definition video and supporting various communication protocols, making it suitable for set-top boxes, gateways, and other multimedia devices. The chip integrates multiple cores, including CPU and GPU components, enabling efficient performance for both data handling and graphical processing.
Key features often include support for 4K video decoding, enhanced security features for content protection, and multiple connectivity options like Ethernet, Wi-Fi, and Bluetooth. The BCM75635 is tailored for seamless streaming and multi-device connectivity, addressing the growing demand for high-quality digital media experiences in homes and enterprises.
Overall, this SoC represents a powerful solution for manufacturers looking to develop next-generation broadband and multimedia devices.

Features

The BCM75635RPKFEBA03G is a highly integrated system-on-chip (SoC) designed for broadband applications. Key features include:
1. Dual-Channel DOCSIS 3.1: Supports high-speed data transmission over cable networks.
2. Integrated Gigabit Ethernet: Provides robust networking capabilities.
3. High Processing Power: Equipped with a multi-core ARM processor for efficient data handling and processing.
4. Advanced Security: Includes hardware-based security features for secure data transmission.
5. Flexible Connectivity: Supports various interfaces, including USB and HDMI, enhancing versatility in application.
6. Power Efficiency: Designed for low power consumption, suitable for residential gateways and set-top boxes.
7. Enhanced QoS: Provides quality of service features for optimized performance in multimedia applications.
8. Scalability: Supports multiple downstream and upstream channels for future-proofing against increasing bandwidth demands.
This SoC is ideal for service providers looking to deliver high-speed internet and multimedia services efficiently.

Package

The BCM75635RPKFEBA03G is packaged in a "QFN" (Quad Flat No-lead) form factor. This type of packaging offers a compact design with a low profile, suitable for high-density applications in consumer electronics and networking devices.

Pinout

The BCM75635RPKFEBA03G is a system-on-chip (SoC) designed for broadband applications, specifically for DOCSIS 3.1 cable modems and gateways. It features a pin count of 256 pins in a BGA (Ball Grid Array) package.
The primary functions of the BCM75635 include:
1. DOCSIS 3.1 Support: Handles high-speed data transmission over cable networks.
2. Integrated Processing: Contains multiple processing cores for efficient data handling and multitasking.
3. Networking Functions: Supports various networking protocols and interfaces, including Ethernet and Wi-Fi.
4. Security Features: Equipped with hardware-based security to protect data integrity and user information.
This SoC is optimized for high performance and low power consumption in broadband residential gateways and other networking devices.

Manufacturer

The manufacturer of the BCM75635RPKFEBA03G is Broadcom Inc. Broadcom is a global technology company that specializes in designing, developing, and supplying a broad range of semiconductor and infrastructure software solutions. The company serves various markets, including data center, networking, software, broadband, wireless, and storage. Broadcom is known for its innovations in networking technologies and semiconductor devices, which are essential for various applications in telecommunications, enterprise storage, and data centers. The BCM75635RPKFEBA03G is a specific product in their portfolio, likely related to broadband and networking solutions.

Application

The BCM75635RPKFEBA03G is a broadband wireless communication chipset primarily used in applications such as cable modem systems, broadband gateways, and residential routers. It supports advanced DOCSIS standards, enabling high-speed internet access and services in residential and commercial environments. Its integration into network devices facilitates enhanced data throughput, improved connectivity, and efficient resource management in wired and wireless networks.

Equivalent

The BCM75635RPKFEBA03G chip is a Broadcom product primarily used in networking applications. Equivalent products include the Qualcomm QCA9531, MediaTek MT7621, and Intel Pentium N4200, as they offer similar performance in networking and communication. However, compatibility and specific features should be verified based on the intended application.

Envío

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Referencia de tarifas de envío (DHL/FedEx):

DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.

FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.

Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.

Pagos

Payment Methods

El plazo de pago es 100% prepagado.

Actualmente, solo aceptamos los siguientes métodos de pago:

1. de PayPal

2. Tarjeta de crédito/débito

3. Transferencia bancaria