BCM56174B0IFSBG

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BCM56174B0IFSBG

16X10G OR 24X1G L3 TSN SWITCH

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Especificaciones

Part Status Active
Base Product Number BCM56174

Descripción general

Description

The BCM56174B0IFSBG is a network switch chip from Broadcom's StrataXGS family, designed for high-performance Ethernet applications. It supports advanced Layer 2 and Layer 3 features, making it suitable for data center, enterprise, and service provider environments. This switch typically features multiple 10/25/40/100 Gigabit Ethernet ports, offering flexibility for various network configurations.
Key attributes include support for Ethernet Virtual Private Network (EVPN), VLANs, Quality of Service (QoS), and multicast capabilities, enabling efficient data management and traffic optimization. The BCM56174 also integrates sophisticated security features, enhancing network protection against various threats.
Its architecture allows for scalability and high data throughput, making it a reliable choice for next-generation networking solutions. Broadcom provides extensive documentation and development support for integrating the BCM56174B0IFSBG into existing systems. Overall, this chip is aimed at facilitating robust, high-speed networking capabilities in modern digital infrastructures.

Features

The BCM56174B0IFSBG is a high-performance switch device designed by Broadcom for use in enterprise networking and data center applications. Key features include:
1. Ports: It supports multiple 10/100/1000 Mbps Ethernet ports, allowing for flexible connectivity options.
2. Layer 2/3 Switching: It provides advanced Layer 2 and Layer 3 switching capabilities, enabling efficient data handling and routing.
3. Power over Ethernet (PoE): It supports PoE, allowing devices to receive power and data over the same Ethernet cable.
4. Traffic Management: Features include Quality of Service (QoS) and traffic management to optimize data flow and ensure reliable performance.
5. Scalability: Designed for scalability, it can support a growing number of devices and increased data traffic.
6. Security: Enhanced security features help protect the network from unauthorized access and threats.
7. Energy Efficiency: Focuses on energy efficiency, reducing power consumption while maintaining high performance.
This switch is ideal for high-density applications, providing robust networking capabilities for modern enterprise environments.

Package

The BCM56174B0IFSBG is packaged in a 48-pin FCLGA (Fine Pitch Ball Grid Array) package.

Pinout

The BCM56174B0IFSBG is a Broadcom Ethernet switch chip that typically features a pin count of 64 pins. This device is designed for high-performance networking applications and supports various functions, including Layer 2 Ethernet switching, forwarding, and QoS (Quality of Service) features.
It integrates multiple 10GbE (10 Gigabit Ethernet) interfaces and supports various protocols, making it suitable for data center and enterprise network applications. Its functions include packet processing, MAC address table management, and VLAN support, enabling efficient network segmentation and traffic management. The BCM56174B0IFSBG is optimized for low latency and high throughput, making it ideal for modern networking environments.
For detailed specifications and pin functions, refer to the official Broadcom datasheet.

Manufacturer

The BCM56174B0IFSBG is manufactured by Broadcom Inc., a global technology company specializing in semiconductors and infrastructure software solutions. Broadcom designs and develops a wide range of products including networking, broadband, wireless, and enterprise storage solutions, catering to various industries such as telecommunications, data centers, and industrial applications. The company is known for its innovations in connectivity technologies and is a significant player in the semiconductor market. Its products are integral to enhancing the performance and efficiency of modern electronic systems.

Application

The BCM56174B0IFSBG is a high-performance Ethernet switch designed for data center and enterprise networking applications. It supports Layer 2 and Layer 3 switching, making it suitable for cloud computing, virtualization, and large-scale network deployments. Its application areas include server virtualization, data center interconnects, enterprise campus networks, and high-bandwidth applications requiring low latency and high throughput.

Equivalent

The BCM56174B0IFSBG chip, a Broadcom Ethernet switch, has equivalent products like the Marvell 88E6340, Microchip LAN937x series, and Texas Instruments TLK10071. Always verify compatibility and specific feature sets when considering alternatives.

Envío

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Referencia de tarifas de envío (DHL/FedEx):

DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.

FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.

Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.

Pagos

Payment Methods

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