BCM3390ZRKFSBG

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BCM3390ZRKFSBG

Broadcom Limited

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  • Mfr. Parte #BCM3390ZRKFSBG
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Especificaciones

Descripción general

Description

The BCM3390ZRKFSBG is a highly integrated System-on-Chip (SoC) designed by Broadcom, primarily aimed at applications in the broadband and networking sectors. It is part of the BCM3390 series, which targets high-performance tasks in consumer electronics, such as set-top boxes, smart TVs, and advanced home networking devices.
Key features of the BCM3390ZRKFSBG include support for high-definition video decoding and encoding, robust connectivity options including Ethernet and Wi-Fi, and compatibility with various multimedia standards. Its architecture typically supports multiple core processing for efficient multitasking and enhanced performance.
The chip is notable for its energy efficiency, which is essential for modern devices that require long operational lifetimes and minimal power consumption. The ZRKFSBG variant may include specific enhancements or configurations tailored for particular applications or device requirements. Overall, the BCM3390ZRKFSBG serves as a versatile solution for developers looking to integrate advanced processing capabilities into their electronic products.

Features

The BCM3390ZRKFSBG is a Bluetooth Low Energy (BLE) system-on-chip (SoC) designed for efficient wireless connectivity. Key features include:
1. Low Power Consumption: Optimized for battery-powered devices, ensuring extended battery life.
2. Integrated Bluetooth 5.0: Supports long-range and high-speed data transfer capabilities.
3. Small Form Factor: Compact design suitable for space-constrained applications.
4. High Processing Power: Equipped with a powerful ARM Cortex-M4 processor for efficient data processing and handling.
5. Versatile Connectivity: Supports various peripherals, including I2C, SPI, UART, and GPIO, for diverse application needs.
6. Enhanced Security: Built-in security features for secure data transmission.
7. Flexible Software Support: Compatible with various development environments and SDKs for easy implementation.
Ideal for IoT applications, wearables, health monitors, smart home devices, and more, the BCM3390ZRKFSBG offers a robust solution for modern wireless communication challenges.

Package

The BCM3390ZRKFSBG is packaged in a 16-pin QFN (Quad Flat No-lead) package, which provides a compact and efficient design suitable for various applications, including communications and networking.

Pinout

The BCM3390ZRKFSBG is a system-on-chip (SoC) from Broadcom, designed primarily for networking and communication applications. It features a total of 256 pins. The device integrates multiple functionalities, including support for Ethernet, various interfaces, and advanced processing capabilities. Key functions include high-performance processing for data packets, support for multiple networking protocols, and enhanced security features.
The pin configuration includes power supply pins, ground pins, and various I/O pins that support interfaces such as SPI, I2C, UART, and GPIO. Additionally, it provides connectivity options for Ethernet and possibly other communication standards, depending on the specific implementation.
For precise details on pin assignments and specific functions, refer to the official Broadcom datasheet or technical documentation for the BCM3390ZRKFSBG.

Manufacturer

The BCM3390ZRKFSBG is manufactured by Broadcom Inc., a prominent American technology company. Broadcom specializes in designing and developing a wide range of semiconductor and infrastructure software solutions. Their products are used in various applications, including networking, broadband, enterprise storage, and wireless communications. Broadcom is known for its innovation in the semiconductor industry and serves a diverse array of markets, including data centers, telecommunications, and industrial sectors. The company plays a critical role in enabling connectivity and enhancing performance across various electronic devices and systems.

Application

The BCM3390ZRKFSBG is a highly integrated system-on-chip (SoC) primarily used in automotive applications, including advanced driver-assistance systems (ADAS), infotainment systems, and vehicle connectivity solutions. It supports high-performance processing, multimedia capabilities, and connectivity features, making it suitable for applications like autonomous driving, navigation, and in-car entertainment. Its versatility also extends to industrial and IoT applications requiring robust processing and communication functionalities.

Equivalent

The BCM3390ZRKFSBG chip is a Bluetooth and Wi-Fi combo chip by Broadcom. Equivalent products include the Qualcomm QCA9377, Cypress CYW43455, and Texas Instruments CC2652R. These alternatives offer similar functionalities in wireless communication, integrating both Wi-Fi and Bluetooth capabilities for embedded systems. Always verify specific requirements and compatibility before selection.

Envío

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Referencia de tarifas de envío (DHL/FedEx):

DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.

FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.

Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.

Pagos

Payment Methods

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