BCM3390ZIFSBG

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BCM3390ZIFSBG

Broadcom Limited

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  • Mfr. Parte #BCM3390ZIFSBG
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  • En stock29793

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Especificaciones

Descripción general

Description

The BCM3390ZIFSBG is a highly integrated system-on-chip (SoC) designed by Broadcom, primarily for use in advanced multimedia applications. It combines a powerful ARM Cortex-A9 processor with robust graphics capabilities, making it suitable for digital media, gaming, and high-performance computing. This SoC supports multiple connectivity options, including Ethernet, USB, and HDMI, enabling seamless integration into various devices such as set-top boxes, smart TVs, and other consumer electronics.
The BCM3390ZIFSBG is optimized for low power consumption while delivering high performance, making it ideal for portable and embedded systems. It also supports advanced video and audio processing features, allowing for rich multimedia experiences. Additionally, the chip includes security features to protect content and data, catering to applications requiring secure environments.
Overall, the BCM3390ZIFSBG serves as a versatile solution for manufacturers looking to enhance their product offerings in the competitive multimedia market.

Features

The BCM3390ZIFSBG is a versatile Bluetooth and Wi-Fi SoC (System on Chip) designed for IoT applications. Key features include:
1. Dual-Mode Bluetooth: Supports both Classic Bluetooth and Bluetooth Low Energy (BLE) for flexible connectivity options.
2. Wi-Fi Connectivity: Integrated Wi-Fi capabilities enable seamless internet access and data transmission.
3. Low Power Consumption: Optimized for battery-operated devices, ensuring extended operational life.
4. Multiple Interfaces: Supports various interfaces like GPIO, SPI, I2C, and UART for enhanced flexibility in device integration.
5. Robust Security Features: Includes hardware-based security protocols to protect data and communications.
6. Compact Size: Designed in a small form factor for easy integration into space-constrained applications.
7. High Performance: Offers reliable performance for real-time applications, ensuring smooth operation in demanding environments.
Overall, the BCM3390ZIFSBG is ideal for smart home devices, wearable technology, and other IoT solutions requiring efficient wireless communication.

Package

The BCM3390ZIFSBG is packaged in a 64-pin QFN (Quad Flat No-lead) package. This type of packaging provides a compact design and efficient thermal performance, suitable for various electronic applications.

Pinout

The BCM3390ZIFSBG is a highly integrated System-on-Chip (SoC) designed for mobile broadband and multimedia applications. It features a total of 128 pins.
The main functions of the BCM3390 include:
1. Wireless Connectivity: It supports various wireless communication protocols, enabling mobile broadband applications.
2. Multimedia Processing: It has capabilities for video and audio processing, enhancing multimedia experiences on devices.
3. High Performance: The chip is designed for high efficiency and performance, suitable for demanding applications in mobile devices.
4. Integration: It integrates multiple functions such as baseband processing, RF, and power management, reducing the need for additional components.
This combination of features makes the BCM3390ZIFSBG optimal for use in smartphones, tablets, and other portable devices. For specific pin assignments and detailed functionalities, consulting the manufacturer's datasheet is recommended.

Manufacturer

The manufacturer of the BCM3390ZIFSBG is Broadcom Inc. Broadcom is a global technology company that specializes in designing, developing, and supplying a broad range of semiconductor and infrastructure software solutions. Founded in 1991, the company operates in various segments, including wired and wireless communications, enterprise storage, and industrial applications. Broadcom is known for its innovations in networking, broadband, and data center technologies, serving customers in multiple industries such as telecommunications, automotive, and consumer electronics. The BCM3390ZIFSBG itself is a system-on-chip (SoC) designed for applications in voice and data communication, showcasing Broadcom's capabilities in integrating complex functions within a single chip.

Application

The BCM3390ZIFSBG is a highly-integrated wireless communication chip suitable for applications such as smart home devices, IoT (Internet of Things) products, wearable technology, and industrial automation. It supports various protocols, enabling efficient connectivity in smart appliances, health monitoring systems, and sensor networks. Additionally, it is used in consumer electronics for enhanced wireless performance and energy efficiency.

Equivalent

The BCM3390ZIFSBG is a Broadcom chip commonly used in various applications. Equivalent products include the BCM3390, BCM3390KIFSBG, and other Broadcom chips with similar specifications, such as the BCM2837 or BCM2710, depending on the specific application requirements like processing power and peripheral support. Always verify compatibility based on the intended use case.

Envío

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ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.


Referencia de tarifas de envío (DHL/FedEx):

DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.

FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.

Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.

Pagos

Payment Methods

El plazo de pago es 100% prepagado.

Actualmente, solo aceptamos los siguientes métodos de pago:

1. de PayPal

2. Tarjeta de crédito/débito

3. Transferencia bancaria