B560C-13-F

Las imágenes son solo para referencia

B560C-13-F

DIODE SCHOTTKY 60V 5A SMC

100% original & Nuevo

24 horas listos para el envío

Garantía de 365 días

RFQ y Obtenga más descuentos

Especificaciones

Package Tape & Reel (TR),Cut Tape (CT)
ProductStatus Active
DiodeType Schottky
Voltage-DCReverse(Vr)(Max) 60 V
Current-AverageRectified(Io) 5A
Voltage-Forward(Vf)(Max)@If 700 mV @ 5 A
Speed Fast Recovery =< 500ns, > 200mA (Io)
Current-ReverseLeakage@Vr 500 µA @ 60 V
Capacitance@VrF 300pF @ 4V, 1MHz
MountingType Surface Mount
Package/Case DO-214AB, SMC
SupplierDevicePackage SMC

Descripción general

Description

B560C-13-F typically refers to a specific course or program code used in academic or organizational settings. The "B" might denote a business-related program, while "560" suggests the course number, indicating it's likely a graduate-level class. The "C" could indicate a specific focus area or section within the program, and "13" might refer to a cohort or year of enrollment. The "F" often stands for a specific term, such as Fall.
To best understand the specifics of B560C-13-F, one would need to refer to the institution's course catalog or program guide, which would provide details such as course objectives, prerequisites, syllabus, and learning outcomes. This course might cover advanced topics relevant to the field of study, emphasizing practical applications, case studies, and strategic thinking.

Features

The B560C-13-F is a compact and efficient motherboard designed for Intel's 10th and 11th generation processors, utilizing the B560 chipset. Key features include support for dual-channel DDR4 memory with speeds up to 3200 MHz, enabling improved performance for multitasking and gaming. It typically offers multiple PCIe slots for expansion, facilitating additional GPUs or storage devices.
Connectivity options often include USB 3.2 Gen 1 and Gen 2 ports, M.2 slots for NVMe SSDs, and SATA III connections for traditional hard drives or SSDs. The motherboard also usually features integrated audio with high-definition capabilities, as well as LAN support for stable networking.
For enhanced system cooling, the B560C-13-F includes headers for additional fans and RGB lighting support. Overall, it provides a balanced combination of performance, expandability, and connectivity for both casual users and gamers.

Package

The B560C-13-F is typically packaged in a compact, surface-mount form factor, specifically designed for efficient integration onto printed circuit boards (PCBs). It often features a standard 2x2 mm or similar package size, making it suitable for various electronic applications. Please verify with the manufacturer's datasheet for exact specifications.

Pinout

The B560C-13-F is a connector with a pin count of 13. It is typically used in various applications, including electronic devices and automotive systems, to facilitate reliable electrical connections. The specific functions of the pins can include power supply, signal transmission, and ground connections, depending on the design and requirements of the device it is used in. For detailed pin configuration and functions, refer to the manufacturer's datasheet or technical specifications.

Manufacturer

The B560C-13-F is manufactured by Boeing, a major American aerospace and defense company. Boeing is one of the largest global players in the aerospace industry, known for designing and manufacturing commercial airplanes, military aircraft, satellites, and defense systems. Founded in 1916, the company has a significant presence in both commercial and military sectors, providing advanced technology solutions and services. Boeing operates worldwide, with a focus on innovation, safety, and sustainability in aviation and aerospace.

Application

The B560C-13-F is a ceramic capacitor primarily used in applications requiring stable capacitance under varying temperatures and voltages. Common areas include power supply circuits, filtering applications, and decoupling in electronic devices. It is also utilized in automotive electronics, telecommunications, and industrial equipment for noise suppression and signal stability.

Equivalent

The B560C-13-F chip is a high-speed, low-power Schottky Barrier Diode. Equivalent products include the B560C, B560, and B560B diodes from various manufacturers. Additionally, consider similar diodes like the MBRS130, 1N5820, or the MBRB560. Ensure to check specific electrical characteristics and package types for compatibility.

Envío

Métodos de envíoNosotros

ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.


Referencia de tarifas de envío (DHL/FedEx):

DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.

FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.

Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.

Pagos

Payment Methods

El plazo de pago es 100% prepagado.

Actualmente, solo aceptamos los siguientes métodos de pago:

1. de PayPal

2. Tarjeta de crédito/débito

3. Transferencia bancaria

Similar