B550C-13-F

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B550C-13-F

DIODE SCHOTTKY 50V 5A SMC

100% original & Nuevo

24 horas listos para el envío

Garantía de 365 días

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Especificaciones

Part Status Active
Base Product Number B550
Voltage - DC Reverse (Vr) (Max) 50 V
Current - Average Rectified (Io) 5A
Voltage - Forward (Vf) (Max) @ If 700 mV @ 5 A
Current - Reverse Leakage @ Vr 500 µA @ 50 V
Capacitance @ Vr, F 300pF @ 4V, 1MHz
Mounting Type Surface Mount
Package DO-214AB, SMC
Supplier Device Package SMC
Operating Temperature - Junction -55°C ~ 150°C
Packaging Cut Tape (CT), Tape & Reel (TR)
Technology Schottky
Speed Fast Recovery =< 500ns, > 200mA (Io)

Descripción general

Description

The B550C-13-F is a motherboard designed for AMD Ryzen processors, based on the B550 chipset. It supports the AM4 socket and is compatible with both Ryzen 3000 and 5000 series CPUs, offering a solid balance of performance and affordability for gamers and content creators alike.
Key features include support for PCIe 4.0, allowing for faster data transfer rates with compatible GPUs and NVMe SSDs. The board typically offers multiple M.2 slots for high-speed storage, USB 3.2 ports for fast connectivity, and robust power delivery systems to ensure stable operation during intense workloads.
Additionally, it often includes customizable RGB lighting, a user-friendly BIOS interface, and various connectivity options, such as HDMI and DisplayPort for integrated graphics. The B550C-13-F is an excellent choice for those looking to build a powerful yet budget-friendly gaming or productivity rig.

Features

The B550C-13-F is a motherboard designed for AMD Ryzen processors, featuring the B550 chipset. Key features include:
1. Socket AM4: Compatible with Ryzen 3000, 4000, and 5000 series CPUs.
2. Dual Channel DDR4: Supports up to 128GB of RAM with speeds up to 4600 MHz (OC).
3. PCIe 4.0 Support: Offers faster data transfer rates for GPUs and NVMe SSDs.
4. Multi-GPU Support: Capable of CrossFire configurations for enhanced graphics performance.
5. Audio: High-definition audio with Realtek ALC892 codec.
6. Connectivity: Multiple USB 3.2 Gen 1 and Gen 2 ports, HDMI, and DisplayPort outputs.
7. Storage Options: M.2 slots supporting PCIe NVMe SSDs and several SATA III ports.
8. Networking: Gigabit Ethernet for reliable connectivity.
9. User-Friendly BIOS: Easy tuning and monitoring capabilities for overclocking.
With these features, the B550C-13-F is suitable for both gaming and content creation.

Package

The B550C-13-F is typically packaged in a compact, surface-mount format, specifically as a dual-in-line package (DIP) or similar configuration, designed for easy integration onto PCBs. It provides efficient connectivity and is suitable for various electronic applications.

Pinout

The B550C-13-F is a type of industrial connector, specifically a circular connector. It features a pin count of 13 pins. The primary function of this connector is to provide reliable electrical connections in various applications, including industrial machinery, automation, and robotics. Its design ensures durability and resistance to environmental factors, making it suitable for harsh operating conditions. The B550C-13-F is typically used in applications requiring secure and stable connections, enabling effective signal transmission and power delivery.

Manufacturer

The B550C-13-F is a product manufactured by BAE Systems, a global defense, aerospace, and security company. BAE Systems is headquartered in London, UK, and operates across various sectors, including military and commercial aerospace, cyber security, and naval systems. The company is involved in the development and production of advanced technologies and systems for defense capabilities, serving clients primarily in government and defense sectors worldwide. BAE Systems is known for its innovation and commitment to providing integrated solutions to meet complex security challenges.

Application

The B550C-13-F is typically used in applications such as industrial automation, robotics, and control systems. It serves in environments requiring reliable connectivity and communication, including data acquisition, process control, and monitoring systems. Its robust design makes it suitable for harsh conditions, making it ideal for manufacturing, transportation, and energy sectors.

Equivalent

The B550C-13-F chip, produced by NXP Semiconductors, is similar to the following products: B550C-13-FS (with additional features), B550C-12-F (a variant with slight specifications changes), and other NXP series chips in the B550 family. For alternatives, you might consider similar chips from manufacturers like Texas Instruments or Analog Devices, depending on your specific application needs. Always check datasheets for detailed comparisons.

Envío

Métodos de envíoNosotros

ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.


Referencia de tarifas de envío (DHL/FedEx):

DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.

FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.

Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.

Pagos

Payment Methods

El plazo de pago es 100% prepagado.

Actualmente, solo aceptamos los siguientes métodos de pago:

1. de PayPal

2. Tarjeta de crédito/débito

3. Transferencia bancaria

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