ASFC32G31T3-51BIN

Las imágenes son solo para referencia

ASFC32G31T3-51BIN

IC FLASH 256GBIT EMMC 153FBGA

100% original & Nuevo

24 horas listos para el envío

Garantía de 365 días

RFQ y Obtenga más descuentos

Especificaciones

Part Status Active
Base Product Number ASFC32G31T3
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NAND (TLC)
Memory Size 256Gbit
Memory Organization 32G x 8
Memory Interface eMMC_5.1
Clock Frequency 200 MHz
Voltage - Supply 2.7V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package 153-TFBGA
Supplier Device Package 153-FBGA (11.5x13)
Packaging Tray

Descripción general

Description

The ASFC32G31T3-51BIN is a specific model of a flash memory device, typically categorized under NOR flash memory. It features a storage capacity of 32 gigabits (4 gigabytes) and is designed for high-performance applications requiring fast read and write speeds. This device often interfaces via a standard SPI (Serial Peripheral Interface) protocol, making it suitable for embedded systems, consumer electronics, and other applications where reliable non-volatile storage is essential.
Key features include low power consumption, endurance for multiple program-erase cycles, and a range of operational voltages. The ASFC32G31T3-51BIN is often used in applications like firmware storage, data logging, and configuration settings in devices. Its compact form factor and robust performance make it a popular choice among developers looking for efficient memory solutions.

Features

The ASFC32G31T3-51BIN is a 32GB eMMC (embedded MultiMediaCard) storage solution designed for various applications, particularly in mobile devices and consumer electronics. Key features include:
1. Storage Capacity: 32GB of flash storage, suitable for apps, media, and system files.
2. Interface: Compliant with eMMC 5.1, ensuring compatibility with a wide range of devices.
3. High Performance: Offers fast read and write speeds, enhancing overall system responsiveness and data transfer rates.
4. Low Power Consumption: Designed for energy efficiency, making it ideal for battery-operated devices.
5. Durability: Features built-in wear leveling and error correction, ensuring reliability and longevity.
6. Compact Size: Ideal for space-constrained designs, allowing for flexibility in device layouts.
7. Versatility: Suitable for smartphones, tablets, IoT devices, and other embedded applications.
Overall, the ASFC32G31T3-51BIN provides a robust solution for modern storage needs in a compact format.

Package

The ASFC32G31T3-51BIN is packaged in a BGA (Ball Grid Array) format. This type of package offers a compact design with multiple solder balls arranged in a grid, allowing for efficient heat dissipation and improved electrical performance suitable for high-density applications.

Pinout

The ASFC32G31T3-51BIN is a 32GB eMMC (embedded MultiMediaCard) memory device. It features a total of 48 pins. The pin functions include:
- Data Pins (D0-D7): These pins are used for data input and output.
- Command Line (CMD): This pin is used for sending commands to the memory.
- Clock (CLK): This pin provides the clock signal for synchronous operation.
- Power Supply (VCC, VCCQ): These pins provide power to the device.
- Ground (GND): These pins are for grounding.
- Write Protect (WP): This pin is used to enable or disable write protection.
The ASFC32G31T3-51BIN is designed for applications requiring reliable, high-capacity storage solutions, typically in smartphones, tablets, and other embedded systems.

Manufacturer

The ASFC32G31T3-51BIN is manufactured by Alliance Memory, Inc. Alliance Memory is a semiconductor company that specializes in memory products, including DRAM and SRAM solutions. The company focuses on providing high-quality memory components that are compatible with various applications in the computing, telecommunications, and consumer electronics industries. They are known for their commitment to customer support and innovation in memory technology.

Application

The ASFC32G31T3-51BIN is a high-performance flash memory device commonly used in embedded systems, automotive applications, industrial automation, and consumer electronics. Its applications include data storage for firmware, configuration parameters, and user settings, as well as memory expansion in IoT devices, smart appliances, and mobile applications. The device’s reliability and speed make it suitable for applications requiring quick data access and durability under various operating conditions.

Equivalent

The ASFC32G31T3-51BIN chip, a 32GB eMMC storage solution, has several equivalent products, including:
1. Samsung KLM4G1FEPD-B031
2. SanDisk SDIN7D2-32G
3. Toshiba THGBM6G5D1HBAIT
Ensure compatibility with your specific application requirements, such as interface and performance specifications.

Envío

Métodos de envíoNosotros

ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.


Referencia de tarifas de envío (DHL/FedEx):

DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.

FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.

Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.

Pagos

Payment Methods

El plazo de pago es 100% prepagado.

Actualmente, solo aceptamos los siguientes métodos de pago:

1. de PayPal

2. Tarjeta de crédito/débito

3. Transferencia bancaria

Similar