AS4C256M16D3C-12BIN

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AS4C256M16D3C-12BIN

IC DRAM 4GBIT PARALLEL 96FBGA

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  • Mfr. Parte #AS4C256M16D3C-12BIN
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  • En stock6911

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Especificaciones

Part Status Active
Base Product Number AS4C256
DigiKey Programmable Not Verified
Memory Type Volatile
Memory Format DRAM
Technology SDRAM - DDR3
Memory Size 4Gbit
Memory Organization 256M x 16
Memory Interface Parallel
Clock Frequency 800 MHz
Write Cycle Time - Word, Page 15ns
Voltage - Supply 1.425V ~ 1.575V
Operating Temperature -40°C ~ 95°C (TC)
Mounting Type Surface Mount
Package 96-TFBGA
Supplier Device Package 96-FBGA (7.5x13.5)
Packaging Tray
Access Time 20 ns

Descripción general

Description

The AS4C256M16D3C-12BIN is a 256 Mb (megabit) DDR3 SDRAM (Synchronous Dynamic Random Access Memory) chip designed for high-performance applications. It operates at a 12 ns cycle time, providing efficient data transfer rates suitable for various electronic devices such as computers, tablets, and smartphones.
This memory chip features a 16-bit data width and supports a dual data rate, meaning it can transfer data on both the rising and falling edges of the clock signal, effectively doubling the data throughput. The AS4C256M16D3C-12BIN operates at a supply voltage of 1.5V, which helps reduce power consumption, making it suitable for battery-operated devices.
The chip is packaged in a compact form, allowing for easy integration into circuit boards. It complies with JEDEC standards, ensuring compatibility with other DDR3 components. Overall, the AS4C256M16D3C-12BIN is ideal for applications requiring high speed and low power consumption in memory solutions.

Features

The AS4C256M16D3C-12BIN is a 4Gb (256Mx16) DDR3 SDRAM memory chip designed for high-performance applications. Key features include:
1. Density: 4 Gigabits (Gb) of memory capacity organized as 256 Megabytes x 16 bits.
2. Data Rate: Operates at a data rate up to 1600 MT/s (megatransfers per second).
3. Operating Voltage: Requires a supply voltage of 1.5V, with a low-power mode option at 1.35V (DDR3L).
4. Package: Typically available in a standard 78-ball TFBGA package, facilitating easy integration into various circuit boards.
5. Latency: Designed for low latency, improving performance in memory-intensive applications.
6. Compatibility: Fully compliant with the DDR3 SDRAM specifications, ensuring compatibility with various systems.
7. Applications: Suitable for use in consumer electronics, computers, networking devices, and other applications requiring fast and efficient memory solutions.
This chip provides a balance of speed, efficiency, and capacity for modern computing needs.

Package

The AS4C256M16D3C-12BIN is a DDR3 SDRAM memory chip packaged in a standard 78-ball micro-BGA (Ball Grid Array) format.

Pinout

The AS4C256M16D3C-12BIN is a 4Gb (512MB) DDR3 SDRAM memory chip with a pin count of 60. It operates with a 16-bit data width and supports a data rate of up to 1600 MT/s. The primary functions of this chip include data storage and providing high-speed memory access in various applications, such as in computing and mobile devices. It features standard DDR3 functionalities like burst read/write, precharge, and refresh operations, making it suitable for use in memory modules and embedded systems. The '-12' in its designation indicates a manufacturing process of 12 nanometers, which contributes to improved performance and power efficiency.

Manufacturer

The AS4C256M16D3C-12BIN is manufactured by Alliance Memory, Inc. Alliance Memory is a semiconductor company that specializes in the production of memory solutions, including DRAM (Dynamic Random Access Memory), SRAM (Static Random Access Memory), and other memory-related products. The company focuses on providing high-quality memory components for various applications in the consumer, industrial, and automotive markets. They offer a range of memory products that are designed to be compatible with legacy systems and serve as drop-in replacements for existing memory solutions.

Application

The AS4C256M16D3C-12BIN is a DDR3 SDRAM memory chip, commonly used in various applications such as consumer electronics, computing devices, networking equipment, automotive systems, and industrial applications. Its high-speed data transfer capability makes it suitable for laptops, desktops, servers, and embedded systems requiring efficient memory performance.

Equivalent

The AS4C256M16D3C-12BIN chip is a DDR3 SDRAM memory chip. Equivalent products include:
1. MT41K256M16HA-125
2. H5TQ2G83BFR
3. K4B4G1646F-BCRC
4. IS43TR16640D-125B
Ensure compatibility with specifications such as voltage, timing, and package type when selecting alternatives.

Envío

Métodos de envíoNosotros

ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.


Referencia de tarifas de envío (DHL/FedEx):

DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.

FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.

Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.

Pagos

Payment Methods

El plazo de pago es 100% prepagado.

Actualmente, solo aceptamos los siguientes métodos de pago:

1. de PayPal

2. Tarjeta de crédito/débito

3. Transferencia bancaria

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