AS4C1G16D4-062BCN

Las imágenes son solo para referencia

AS4C1G16D4-062BCN

IC DRAM 16GBIT PARALLEL 96FBGA

  • Fabricante
  • Mfr. Parte #AS4C1G16D4-062BCN
  • Paquete
  • Hoja de datos
  • En stock20778

100% original & Nuevo

24 horas listos para el envío

Garantía de 365 días

RFQ y Obtenga más descuentos

Especificaciones

Part Status Active
Base Product Number AS4C1G16
DigiKey Programmable Not Verified
Memory Type Volatile
Memory Format DRAM
Technology SDRAM - DDR4
Memory Size 16Gbit
Memory Organization 1G x 16
Memory Interface Parallel
Clock Frequency 1.6 GHz
Write Cycle Time - Word, Page 15ns
Voltage - Supply 1.14V ~ 1.26V
Operating Temperature 0°C ~ 95°C (TC)
Mounting Type Surface Mount
Package 96-TFBGA
Supplier Device Package 96-FBGA (9x13)
Packaging Tray
Access Time 19 ns

Descripción general

Description

AS4C1G16D4-062BCN is a memory device part number (AS4C family). In these codes:
- AS4C = memory family
- 1G = 1 Gbit density
- 16 = data width (often 16-bit)
- D4 = organization/technology (often x4)
- 062 = speed grade or timing/process indicator
- BCN = packaging/grade
The exact type (DRAM vs. NAND flash), voltage, timings, and package depend on the vendor’s datasheet. It’s used as a memory component in devices, for data storage or as system RAM/flash. For a precise introduction with specs, please share the vendor or a link to the datasheet.

Features

AS4C1G16D4-062BCN looks like a NAND flash device (exact features depend on the vendor/datasheet). If it is a 1 Gbit x16 device, typical features include:
- Density: ~1 Gbit per die with a 16-bit I/O interface
- NAND type: MLC (multi-level cell)
- Page size: commonly 2 KB (with a spare area of 64–128 bytes); some variants use 4 KB pages
- Interface: ONFI-compatible (revision varies by part)
- Supply/IO: standard flash voltages (often 3.3 V I/O, with device core supply per datasheet)
- Error handling: ECC via host/controller (often BCH), with bad-block management
- Performance features: multi-plane operations, cache/copy-back, read/write streaming
- Endurance: typical program/erase (P/E) cycles in the low thousands per block
- Temperature range: industrial options available (e.g., -40°C to 85°C in many parts)
Notes:
- Exact timings, voltage levels, page size, ECC strength, and endurance depend on the manufacturer and revision. Provide the datasheet for precise specs.

Package

62-ball BGA package (BGA-62).

Pinout

- Pin count: 96 pins (96-ball BGA)
- Function: DDR3 SDRAM device, density 1 Gb, organization x16 (1Gbit, 16-bit data width) with a standard DDR3 interface (CK/CK#, CS#, CKE, RAS#, CAS#, WE#, BA0–BA2, A0–A12, DQ0–DQ15, DQS, DM, Vcc/Vss). Used as a memory device on modules requiring a 16-bit data path.

Manufacturer

- Manufacturer: Alliance Memory, Inc.
- Company type: A semiconductor memory company (fabless), designing and selling memory solutions such as SRAM/DRAM/PSRAM for embedded and consumer applications.

Envío

Métodos de envíoNosotros

ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.


Referencia de tarifas de envío (DHL/FedEx):

DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.

FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.

Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.

Pagos

Payment Methods

El plazo de pago es 100% prepagado.

Actualmente, solo aceptamos los siguientes métodos de pago:

1. de PayPal

2. Tarjeta de crédito/débito

3. Transferencia bancaria

Similar