A2F200M3F-FGG256

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A2F200M3F-FGG256

IC SOC CORTEX-M3 80MHZ 256FBGA

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  • Mfr. Parte #A2F200M3F-FGG256
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  • En stock9230

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Especificaciones

Series SmartFusion®
Part Status Active
Architecture MCU, FPGA
Core Processor ARM® Cortex®-M3
Flash Size 256KB
RAM Size 64KB
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Speed 80MHz
Primary Attributes ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 256-LBGA
Supplier Device Package 256-FPBGA (17x17)
Base Product Number A2F200

Descripción general

Description

The A2F200M3F-FGG256 is a field-programmable gate array (FPGA) from the Aeries series by Microchip Technology. It features a 256-ball grid array (BGA) package, with a compact design suitable for various applications in embedded systems and digital signal processing. This FPGA integrates a range of programmable logic resources, including logic cells, I/O pins, and embedded memory blocks, allowing for flexible hardware configurations and rapid prototyping.
Key features include support for various communication protocols, extensive digital signal processing capabilities, and energy-efficient operation. The device can be programmed using various hardware description languages, such as VHDL or Verilog. It is ideal for applications in automotive, industrial automation, consumer electronics, and telecommunications.
Overall, the A2F200M3F-FGG256 FPGA offers a balance of performance, versatility, and ease of integration, making it suitable for developers looking to implement custom logic solutions efficiently.

Features

The A2F200M3F-FGG256 is a field-programmable gate array (FPGA) from the Achronix Speedster series. Key features include:
- Logic Cells: Contains 200,000 logic cells for versatile digital logic implementation.
- High-Speed I/O: Supports up to 48 high-speed SerDes (serializer/deserializer) channels for high-bandwidth data transfer.
- Memory: Integrated with extensive on-chip SRAM for efficient data processing and storage.
- Power Efficiency: Designed for low power consumption while maintaining high performance.
- Reconfigurability: Allows for real-time reconfiguration to adapt to changing application needs.
- FPGA Architecture: Utilizes a unique architecture optimized for high-performance applications in networking and data centers.
- Package: Available in a FGG256 package for easy integration into various systems.
This FPGA is ideal for applications requiring high throughput, flexibility, and low latency, such as networking, data processing, and machine learning tasks.

Package

The A2F200M3F-FGG256 is packaged in a Fine Pitch Grid Array (FPGA) format, specifically a 256-pin FGG (Fine Grid Array) package. This type of package offers a compact footprint and good thermal performance, suitable for various applications in embedded systems.

Pinout

The A2F200M3F-FGG256 is an FPGA (Field-Programmable Gate Array) from Microsemi's SmartFusion2 series. It features a pin count of 256 pins in a Fine-Pitch Ball Grid Array (FBGA) package.
The device offers a variety of functions, including programmable logic, embedded memory, and digital signal processing capabilities. It supports a range of I/O standards, enabling it to interface with different types of external components. The A2F200M3F-FGG256 is designed for applications such as automotive, industrial, and communication systems, where flexibility and reliability are paramount.
Additionally, it incorporates features like built-in flash memory and an ARM Cortex-M3 processor, further enhancing its functionality for diverse applications.

Manufacturer

The A2F200M3F-FGG256 is manufactured by Microchip Technology Inc., a leading American semiconductor company. Microchip specializes in microcontrollers, mixed-signal, analog, and Flash-IP solutions. Founded in 1989, the company serves a wide range of industries, including automotive, industrial, consumer, and telecommunications. Microchip is known for its strong focus on embedded control applications and provides a variety of development tools and software to support its products. The A2F200M3F-FGG256 is part of their FPGA (Field-Programmable Gate Array) offerings, aimed at enabling customizable hardware solutions for various applications.

Application

The A2F200M3F-FGG256 is a versatile FPGA that is commonly used in applications such as automotive systems, industrial automation, communications, medical devices, and consumer electronics. It supports real-time processing, high-speed data handling, and customizable logic functions, making it suitable for tasks like signal processing, control systems, and embedded processing in various environments.

Equivalent

The A2F200M3F-FGG256 chip is an FPGA from the Actel/Microsemi Fusion family. Equivalent products include:
1. Lattice Semiconductor's LatticeECP3 series.
2. Xilinx's Spartan-6 series.
3. Altera's Cyclone IV series.
Compatibility may vary based on specific design requirements, so verify functionality and resource availability when considering alternatives.

Envío

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Referencia de tarifas de envío (DHL/FedEx):

DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.

FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.

Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.

Pagos

Payment Methods

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Actualmente, solo aceptamos los siguientes métodos de pago:

1. de PayPal

2. Tarjeta de crédito/débito

3. Transferencia bancaria

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