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10M04SAU324I7G
IC FPGA 246 I/O 324UBGA
- Fabricante
- Mfr. Parte #10M04SAU324I7G
- Paquete UBGA-324
- Hoja de datos
- En stock4395
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Especificaciones
| Package | Tray |
| Series | MAX® 10 |
| ProductStatus | Active |
| NumberofLABs/CLBs | 250 |
| NumberofLogicElements/Cells | 4000 |
| TotalRAMBits | 193536 |
| NumberofI/O | 246 |
| Voltage-Supply | 2.85V ~ 3.465V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 324-LFBGA |
Descripción general
Description
The "04" denotes the density of the FPGA, with larger numbers typically indicating higher logic element counts and more capabilities. "SA" signifies the package type and speed grade, while "U" indicates a specific version or configuration. The "324" part often relates to the number of pins or I/O capabilities. The "I7G" suffix may represent additional specifications, such as temperature range or industry compliance.
Overall, this FPGA is designed for applications that require programmable logic, allowing developers to customize hardware functionality according to specific project requirements.
Features
1. Capacity: It offers 4,000 logic elements, enabling complex designs.
2. I/O Pins: Contains 324 programmable I/O pins, supporting various communication protocols.
3. Low Power Consumption: Designed for energy efficiency, making it suitable for battery-operated devices.
4. Embedded Memory: Features embedded RAM blocks for efficient data storage and processing.
5. Flexible Configuration: Supports various configuration options, allowing for tailored applications.
6. Integrated DSP Blocks: Contains dedicated digital signal processing capabilities for enhanced signal manipulation.
7. Development Tools: Compatible with Intel's Quartus Prime software for design and programming, providing a user-friendly development experience.
These features make the 10M04SAU324I7G ideal for applications such as communications, automotive, and industrial control systems.
Package
Pinout
The main functions of the 10M04SAU324I7G include:
1. Configurable Logic Blocks (CLBs): Allow for custom digital logic design.
2. Embedded Memory: Supports RAM and ROM functionalities for data storage.
3. Digital Signal Processing (DSP): Capable of handling complex mathematical operations.
4. Flexible I/O Support: Can interface with various communication protocols (e.g., SPI, I2C).
5. Low Power Consumption: Designed for energy-efficient applications.
This device is suitable for a wide range of applications, including automotive, industrial, and consumer electronics, due to its versatility and performance capabilities.
Manufacturer
Application
Equivalent
1. Lattice ICE40 series (e.g., ICE40-HX)
2. Xilinx Spartan-6
3. Microsemi SmartFusion2
These alternatives offer similar functionalities in FPGA applications but may differ in specific features and performance characteristics. Always verify compatibility based on your application requirements.
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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