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10AX115H3F34E2SG
IC FPGA 504 I/O 1152FBGA
- Fabricante
- Mfr. Parte #10AX115H3F34E2SG
- Paquete
- Hoja de datos
- En stock7654
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Especificaciones
| Series | Arria 10 GX |
| Part Status | Active |
| DigiKey Programmable | Not Verified |
| Number of LABs/CLBs | 427200 |
| Number of Logic Elements/Cells | 1150000 |
| Total RAM Bits | 68857856 |
| Number of I/O | 504 |
| Voltage - Supply | 0.87V ~ 0.93V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Package | 1152-BBGA, FCBGA |
| Supplier Device Package | 1152-FCBGA (35x35) |
| Packaging | Tray |
Descripción general
Description
Key specifications include a logic element count of approximately 1.15 million, support for high-bandwidth memory interfaces, and a versatile architecture that enables efficient design for complex algorithms. The device is optimized for applications in areas like data centers, telecommunications, and high-performance computing tasks.
With features like dynamic partial reconfiguration and energy-efficient processing, the 10AX115H3F34E2SG is well-suited for modern design challenges, allowing engineers to customize hardware functionality on the fly while maintaining high performance.
Features
1. Architecture: Utilizes a 10nm process technology, offering improved performance and power efficiency.
2. Logic Elements: Contains up to 115K logic elements, enabling complex designs.
3. DSP Blocks: Includes 528 DSP blocks for high-speed arithmetic operations, ideal for signal processing applications.
4. Memory: Features embedded memory options (up to 3.8 Mb) for efficient data storage and access.
5. Transceivers: Equipped with high-speed transceivers supporting various protocols, aiding in communication applications.
6. I/O Support: Offers versatile I/O standards, facilitating seamless integration with other devices.
7. Power Efficiency: Designed for low power consumption, enhancing overall system efficiency.
8. Development Tools: Supported by Intel’s design software, providing ease of use for FPGA development.
These features make the 10AX115H3F34E2SG suitable for applications in data centers, telecommunications, and industrial automation.
Package
Pinout
The functions of the pins include a variety of I/O standards, configuration pins, power supply pins, and dedicated interconnects for high-speed communication. The FPGA supports multiple interfaces such as LVDS, PCIe, and Ethernet to facilitate connectivity in complex applications. The architecture allows for extensive flexibility in designing custom logic and integrating various peripherals. The exact pin functions can be detailed further in the device's datasheet, which outlines the specific assignments and capabilities of each pin.
Manufacturer
Application
Equivalent
1. Xilinx Kintex-7 series (e.g., XCKU035)
2. Lattice ECP5 series (e.g., LFE5UM-25F)
3. Microsemi SmartFusion2 (e.g., M2S050)
4. Intel Cyclone V (e.g., 5CEBA4)
Consider specifications like logic elements, I/O count, and power requirements when selecting equivalents.
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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