10AX115H3F34E2SG

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10AX115H3F34E2SG

IC FPGA 504 I/O 1152FBGA

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  • Mfr. Parte #10AX115H3F34E2SG
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Especificaciones

Series Arria 10 GX
Part Status Active
DigiKey Programmable Not Verified
Number of LABs/CLBs 427200
Number of Logic Elements/Cells 1150000
Total RAM Bits 68857856
Number of I/O 504
Voltage - Supply 0.87V ~ 0.93V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 100°C (TJ)
Package 1152-BBGA, FCBGA
Supplier Device Package 1152-FCBGA (35x35)
Packaging Tray

Descripción general

Description

The 10AX115H3F34E2SG is a specific model of FPGA (Field Programmable Gate Array) produced by Intel, part of the Stratix 10 family. This FPGA is designed for high-performance computing applications, offering advanced features such as high-speed transceivers, multiple I/O standards, and extensive programmable logic resources.
Key specifications include a logic element count of approximately 1.15 million, support for high-bandwidth memory interfaces, and a versatile architecture that enables efficient design for complex algorithms. The device is optimized for applications in areas like data centers, telecommunications, and high-performance computing tasks.
With features like dynamic partial reconfiguration and energy-efficient processing, the 10AX115H3F34E2SG is well-suited for modern design challenges, allowing engineers to customize hardware functionality on the fly while maintaining high performance.

Features

The 10AX115H3F34E2SG is a member of the Intel Agilex FPGA family known for its high performance and flexibility. Key features include:
1. Architecture: Utilizes a 10nm process technology, offering improved performance and power efficiency.
2. Logic Elements: Contains up to 115K logic elements, enabling complex designs.
3. DSP Blocks: Includes 528 DSP blocks for high-speed arithmetic operations, ideal for signal processing applications.
4. Memory: Features embedded memory options (up to 3.8 Mb) for efficient data storage and access.
5. Transceivers: Equipped with high-speed transceivers supporting various protocols, aiding in communication applications.
6. I/O Support: Offers versatile I/O standards, facilitating seamless integration with other devices.
7. Power Efficiency: Designed for low power consumption, enhancing overall system efficiency.
8. Development Tools: Supported by Intel’s design software, providing ease of use for FPGA development.
These features make the 10AX115H3F34E2SG suitable for applications in data centers, telecommunications, and industrial automation.

Package

The package type of the 10AX115H3F34E2SG is a F324 package, which is a Flip-Chip Ball Grid Array (FCBGA). This packaging is designed for high-performance applications and offers efficient thermal management and space-saving benefits.

Pinout

The 10AX115H3F34E2SG is an Intel Stratix 10 FPGA that features a pin count of 1,152 pins. This device is part of the Stratix 10 family, which offers advanced capabilities for high-performance computing and processing tasks.
The functions of the pins include a variety of I/O standards, configuration pins, power supply pins, and dedicated interconnects for high-speed communication. The FPGA supports multiple interfaces such as LVDS, PCIe, and Ethernet to facilitate connectivity in complex applications. The architecture allows for extensive flexibility in designing custom logic and integrating various peripherals. The exact pin functions can be detailed further in the device's datasheet, which outlines the specific assignments and capabilities of each pin.

Manufacturer

The manufacturer of the 10AX115H3F34E2SG is Intel Corporation. Intel is a multinational technology company headquartered in Santa Clara, California, primarily known for designing and producing semiconductor products, including microprocessors, integrated circuits, and other computing components. Founded in 1968, Intel has played a crucial role in the development of computer technology and is one of the world's largest and highest-valued semiconductor chip manufacturers. The company's products are widely used in personal computers, servers, and various computing devices, making it a key player in the tech industry. Intel also invests in research and development, focusing on innovation in areas such as artificial intelligence, data centers, and cloud computing.

Application

The 10AX115H3F34E2SG is a SoC FPGA from Intel, suitable for various applications such as digital signal processing, telecommunications, video and image processing, automotive systems, industrial automation, and high-performance computing. Its flexibility and processing power make it ideal for applications requiring real-time data processing, custom hardware acceleration, and integration of various protocols and interfaces.

Equivalent

The 10AX115H3F34E2SG is an Intel FPGA. Equivalent products include:
1. Xilinx Kintex-7 series (e.g., XCKU035)
2. Lattice ECP5 series (e.g., LFE5UM-25F)
3. Microsemi SmartFusion2 (e.g., M2S050)
4. Intel Cyclone V (e.g., 5CEBA4)
Consider specifications like logic elements, I/O count, and power requirements when selecting equivalents.

Envío

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Referencia de tarifas de envío (DHL/FedEx):

DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.

FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.

Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.

Pagos

Payment Methods

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