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10AX016E4F27E3SG
IC FPGA 240 I/O 672FBGA
- Fabricante
- Mfr. Parte #10AX016E4F27E3SG
- Paquete FBGA-672
- Hoja de datos
- En stock2613
100% original & Nuevo
24 horas listos para el envío
Garantía de 365 días
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Especificaciones
| Package | Tray |
| Series | Arria 10 GX |
| ProductStatus | Active |
| NumberofLABs/CLBs | 61510 |
| NumberofLogicElements/Cells | 160000 |
| TotalRAMBits | 10086400 |
| NumberofI/O | 240 |
| Voltage-Supply | 0.87V ~ 0.93V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 100°C (TJ) |
| Package/Case | 672-BBGA, FCBGA |
Descripción general
Description
Key features include:
- Logic Elements: Provides a large number of configurable logic blocks.
- DSP Blocks: Optimized for intensive computational tasks, enhancing performance in signal processing.
- Memory: Integrated memory resources for efficient data handling.
- Transceivers: Supports high-speed data communication, ideal for networking and storage applications.
- Power Efficiency: Designed for low power consumption while maintaining performance.
Common applications include telecommunications, automotive, industrial automation, and data centers. The model number can help identify specific configurations and features, such as memory size and packaging options.
Features
1. Architecture: Utilizes a 10nm process technology for improved power efficiency and performance.
2. Logic Elements: Contains 16,000 adaptive logic modules (ALMs) for flexible logic implementation.
3. DSP Blocks: Integrates digital signal processing (DSP) blocks optimized for high-speed arithmetic operations.
4. Memory: Features on-chip memory resources, including SRAM and configuration memories for enhanced data handling.
5. I/O Capabilities: Supports high-speed I/O interfaces, allowing for a range of connectivity options including PCIe and Ethernet.
6. AI Acceleration: Enhanced support for artificial intelligence (AI) workloads with dedicated hardware capabilities.
7. Reliability: Designed for robustness in critical applications, with features supporting fault tolerance and reliability.
These attributes make the 10AX016E4F27E3SG suitable for diverse applications such as data centers, telecommunications, and embedded systems.
Package
Pinout
Manufacturer
Application
Equivalent
1. Xilinx Kintex-7 FPGA (e.g., XCKU035)
2. Lattice ECP5 FPGA (e.g., LFE5U-25)
3. Microsemi SmartFusion 2 (e.g., M2S010)
Ensure to check specific requirements like power, I/O count, and performance for precise compatibility.
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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